公开(公告)号：US20220139624A1

公开(公告)日：2022-05-05

申请号：US17398524

申请日：2021-08-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyu Jeong SIM ,  Ho Sam CHOI ,  Seung Min KANG ,  Jin Kyu KIM ,  Jae Won KIM ,  So Hyeon HONG ,  Jong Ho LEE ,  Chung Eun LEE

IPC: H01G4/12 ,  H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/248

Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00

公开(公告)号：US20180027658A1

公开(公告)日：2018-01-25

申请号：US15492447

申请日：2017-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Sam CHOI ,  Ki Pyo HONG

IPC: H05K1/18 ,  H01G4/012 ,  H01G4/232 ,  H05K1/11 ,  H01G4/30

CPC classification number: H05K1/181 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/10015 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.

公开(公告)号：US20250166922A1

公开(公告)日：2025-05-22

申请号：US18795951

申请日：2024-08-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyo Sung CHOI ,  Jung Jin PARK ,  Ho Sam CHOI ,  Dae Jin SHIM ,  Seung Yong LEE ,  Yong Hwa LEE ,  Jong Ho LEE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body. The cover portion may include barium (Ba), gallium (Ga), and tin (Sn), and a ratio (A/B) of the number of moles (A) of gallium (Ga) to 100 moles of barium (Ba) included in the cover portion to the number of moles (B) of tin (Sn) compared to 100 moles of barium (Ba) included in the cover portion may satisfy 0.2≤A/B≤4.0.

公开(公告)号：US20250157743A1

公开(公告)日：2025-05-15

申请号：US18921252

申请日：2024-10-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Jin PARK ,  Ho Sam CHOI ,  Dae Jin SHIM ,  Hyo Sung CHOI ,  Seung Yong LEE ,  Yong Hwa LEE ,  Jin Bok SHIN ,  Hyo Sub KIM ,  Dong Jun JUNG ,  Jong Ho LEE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: A multilayer electronic component includes: a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on upper and bottom surfaces of the capacitance formation portion in the first direction; and an external electrode disposed on the body, and the cover portion may include titanium (Ti), gallium (Ga), and phosphorus (P), and a molar amount of gallium (Ga) with respect to 100 moles of titanium (Ti) included in the cover portion may be 0.3 moles or more and 6.0 moles or less.

公开(公告)号：US20240194410A1

公开(公告)日：2024-06-13

申请号：US18198533

申请日：2023-05-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Sam CHOI ,  Kyu Jeong SIM ,  Hyo Sung CHOI ,  Jung Jin PARK ,  Jong Ho LEE

IPC: H01G4/30 ,  C04B35/626 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/30 ,  C04B35/6262 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/224

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on end surfaces of the capacitance forming portion; and an external electrode disposed on the body, wherein a ratio of an average content of zirconium (Zr) included in the capacitance forming portion to an average content of zirconium (Zr) included in the cover portion satisfies 0.55 or more and 1.00 or less, wherein an average content of zirconium (Zr) included in the capacitance forming portion satisfies 1073 ppm or more and 1950 ppm or less, and wherein an average size of the dielectric grains included in a central region of the capacitance forming portion is 200 nm or more and 300 nm or less, and a standard deviation for a size is 100 nm or more and 130 nm or less.

公开(公告)号：US20170287639A1

公开(公告)日：2017-10-05

申请号：US15289603

申请日：2016-10-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Sam CHOI ,  Jong Ho LEE ,  Min Hoe KIM

IPC: H01G4/30 ,  C04B35/468 ,  H01G4/005 ,  H01G2/10 ,  H01G4/12 ,  H01G4/228

CPC classification number: H01G4/30 ,  B32B18/00 ,  C04B35/4682 ,  C04B35/491 ,  C04B2235/3208 ,  C04B2235/3215 ,  C04B2235/6582 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2237/346 ,  C04B2237/348 ,  H01G2/103 ,  H01G4/005 ,  H01G4/1209 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/228

Abstract: A ceramic composition includes a ceramic powder and a phosphor (P). The phosphor (P) has a content of 1 to 2 wt %, based on a total weight of the ceramic powder not including the phosphor (P).

公开(公告)号：US20250029787A1

公开(公告)日：2025-01-23

申请号：US18627255

申请日：2024-04-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Jin PARK ,  Yong PARK ,  Kwan Soo PARK ,  Ho Sam CHOI ,  Rak Hyeon BAEK ,  Hyo Sung CHOI ,  Sun Mi KIM ,  Jong Ho LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/232

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the cover portion includes polydopamine.

公开(公告)号：US20240234034A1

公开(公告)日：2024-07-11

申请号：US18139444

申请日：2023-04-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyo Sung CHOI ,  Jung Jin PARK ,  Ho Sam CHOI ,  Jae Won KIM ,  Sun Mi KIM ,  Jong Ho LEE

IPC: H01G4/30 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/30 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/224

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.

公开(公告)号：US20240170216A1

公开(公告)日：2024-05-23

申请号：US18218234

申请日：2023-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Jin PARK ,  Dae Jin SHIM ,  Jung Jin PARK ,  Jae Won KIM ,  Hyo Sung CHOI ,  Ho Sam CHOI ,  Sun Mi KIM ,  Jong Ho LEE

IPC: H01G4/14 ,  B82Y30/00

CPC classification number: H01G4/14 ,  B82Y30/00 ,  H01G4/306

Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.

公开(公告)号：US20220139622A1

公开(公告)日：2022-05-05

申请号：US17222550

申请日：2021-04-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Min KANG ,  Ho Sam CHOI ,  Jong Ho LEE ,  So Hyeon HONG

IPC: H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A≥2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D