-
1.发明申请公开(公告)号：US20220416123A1
公开(公告)日：2022-12-29
申请号：US17897821
申请日：2022-08-29
发明人： Kyungwook HWANG , Sungjin KANG , Euijoon YOON , Junsik HWANG , Jongmyeong KIM , Jehong OH , Jungel RYU , Seungmin LEE
摘要： Provided are a light-emitting diode (LED) device, a method of manufacturing the LED device, and a display apparatus including the LED device. The LED device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. The light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.
-
2.发明申请公开(公告)号：US20210184070A1
公开(公告)日：2021-06-17
申请号：US16883363
申请日：2020-05-26
发明人： Kyungwook HWANG , Jungel RYU , Sungjin KANG , Jongmyeong KIM , Jehong OH , Euijoon YOON , Seungmin LEE , Junsik HWANG
摘要： A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.
-
3.发明申请公开(公告)号：US20210159361A1
公开(公告)日：2021-05-27
申请号：US16845457
申请日：2020-04-10
发明人： Kyungwook HWANG , Sungjin KANG , Euijoon YOON , Junsik HWANG , Jongmyeong KIM , Jehong OH , Jungel RYU , Seungmin LEE
摘要： Provided are a light-emitting diode (LED) device, a method of manufacturing the LED device, and a display apparatus including the LED device. The LED device includes a light-emitting layer having a core-shell structure, a passivation layer provided to cover a portion of a top surface of the first semiconductor layer, a first electrode provided on the light-emitting layer, and a second electrode provided under the light-emitting layer. The light-emitting layer includes a first semiconductor layer, an active layer, and a second semiconductor layer. The first electrode is provided to contact the first semiconductor layer, and the second electrode is provided to contact the second semiconductor layer.
-
公开(公告)号：US20220037396A1
公开(公告)日：2022-02-03
申请号：US17501996
申请日：2021-10-14
发明人： Jinjoo PARK , Hoyoung AHN , Junhee CHOI , Sungjin KANG , Junghun PARK
摘要： A high-resolution display device is provided. The high-resolution display device includes a light-emitting layer including a first semiconductor layer, an active layer, and a second semiconductor layer, a plurality of transparent electrodes respectively formed on the second semiconductor layer in sub-pixel regions, a first electrode connected to the first semiconductor layer, a plurality of second electrodes connected to the plurality of transparent electrodes, a color-converting layer arranged over the light-emitting layer and configured to emit light of a predetermined color based on light generated by the light-emitting layer, which are sequentially stacked on a substrate including a plurality of sub-pixel regions. One or more ion injection regions corresponding to current injection regions corresponding to the plurality of the sub-pixel regions is formed in the second semiconductor layer.
-
公开(公告)号：US20210091257A1
公开(公告)日：2021-03-25
申请号：US16822673
申请日：2020-03-18
发明人： Kyungwook HWANG , Sungjin KANG , Junsik HWANG , Junhee CHOI
IPC分类号： H01L33/00 , H01L33/62 , H01L33/50 , H01L25/075
摘要： Provided is a display device including a substrate, a transfer guiding mold provided on the substrate and including a plurality of openings, and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guiding mold is less than twice a height of each of the plurality of micro LEDs.
-
公开(公告)号：US20230275184A1
公开(公告)日：2023-08-31
申请号：US18144566
申请日：2023-05-08
发明人： Junsik HWANG , Sungjin KANG , Kyungwook HWANG , Junhee CHOI
IPC分类号： H01L33/20 , H01L25/075 , H01L33/62 , H01L33/38
CPC分类号： H01L33/20 , H01L25/0753 , H01L33/62 , H01L33/382
摘要： A light-emitting diode (LED) includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first electrode pad, a second electrode pad and a third electrode pad disposed on the second semiconductor layer in a direction from a corner of the second semiconductor layer to an opposite corner of the second semiconductor layer. An LED includes a first electrode pad disposed at a center of the LED and in contact with a P-type semiconductor layer and a second electrode pad in contact with an N-type semiconductor layer, wherein the second electrode pad is disposed a maximum distance away from the first electrode pad on the same surface.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.02 秒)
