公开(公告)号：US20230282624A1

公开(公告)日：2023-09-07

申请号：US17994161

申请日：2022-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： BONG WEE YU ,  EUN-HEE KIM ,  KYOUNG-MIN LEE

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/182 ,  H01L2924/1434 ,  H01L2924/1431 ,  H01L2924/3011 ,  H01L2224/32225 ,  H01L2224/16235 ,  H01L2224/73204

Abstract: An integrated circuit chip includes; a package substrate including a first signal ball, a first semiconductor chip on the package substrate, a second semiconductor chip on the first semiconductor chip, a first bump disposed between the package substrate and the first semiconductor chip and electrically connected to the first signal ball, and a second bump disposed between the first semiconductor chip and the second semiconductor chip and electrically connected to the first signal ball, wherein during a first mode, the first signal ball receives a signal from the first semiconductor chip through the first bump and receives a signal from the second semiconductor chip through the second bump.