公开(公告)号：US20230282624A1

公开(公告)日：2023-09-07

申请号：US17994161

申请日：2022-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： BONG WEE YU ,  EUN-HEE KIM ,  KYOUNG-MIN LEE

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L25/105 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/16 ,  H01L24/73 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/182 ,  H01L2924/1434 ,  H01L2924/1431 ,  H01L2924/3011 ,  H01L2224/32225 ,  H01L2224/16235 ,  H01L2224/73204

Abstract: An integrated circuit chip includes; a package substrate including a first signal ball, a first semiconductor chip on the package substrate, a second semiconductor chip on the first semiconductor chip, a first bump disposed between the package substrate and the first semiconductor chip and electrically connected to the first signal ball, and a second bump disposed between the first semiconductor chip and the second semiconductor chip and electrically connected to the first signal ball, wherein during a first mode, the first signal ball receives a signal from the first semiconductor chip through the first bump and receives a signal from the second semiconductor chip through the second bump.

公开(公告)号：US20190229100A1

公开(公告)日：2019-07-25

申请号：US16056709

申请日：2018-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YUNHYEOK IM ,  KYOUNG-MIN LEE ,  KYUNGSOO LEE ,  HORANG JANG

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/367 ,  H01L23/42

Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interpose between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.

公开(公告)号：US20200251455A1

公开(公告)日：2020-08-06

申请号：US16854971

申请日：2020-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YUNHYEOK IM ,  KYOUNG-MIN LEE ,  KYUNGSOO LEE ,  HORANG JANG

IPC: H01L25/10 ,  H01L23/42 ,  H01L23/498 ,  H01L23/367 ,  H01L23/538 ,  H01L23/552

Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.