公开(公告)号：US20180311764A1

公开(公告)日：2018-11-01

申请号：US16029828

申请日：2018-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoo KIM ,  Il-Sang LEE ,  Yong-sun KO ,  Chang-Gil RYU ,  Kun-Tack LEE ,  Hyo-San LEE

IPC: B23K26/146 ,  H01L21/687 ,  H01L21/67 ,  B08B3/10 ,  C11D11/00 ,  B08B7/00

CPC classification number: B23K26/146 ,  B08B3/10 ,  B08B7/0071 ,  C11D11/0047 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68785 ,  H01L21/68792

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.

公开(公告)号：US20160236318A1

公开(公告)日：2016-08-18

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok CHOI ,  Chang-Gil RYU ,  Geun-Young SONG ,  Ki-Yeon CHU ,  Jin-Suk HONG

IPC: B24B37/32

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Abstract translation: 抛光头包括用于吸附和加压基板的基板载体，以及固定在基板载体下方的保持环，保持环围绕基板的圆周并且包括通过其的冷却通道以循环冷却剂流体。

公开(公告)号：US20160071745A1

公开(公告)日：2016-03-10

申请号：US14706546

申请日：2015-05-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoo KIM ,  Il-Sang LEE ,  Yong-sun KO ,  Chang-Gil RYU ,  Kun-Tack LEE ,  Hyo-San LEE

IPC: H01L21/67 ,  H01L21/683 ,  B23K26/146 ,  B08B3/08 ,  B08B7/00

CPC classification number: B23K26/146 ,  B08B3/10 ,  B08B7/0071 ,  C11D11/0047 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/68785 ,  H01L21/68792

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.

Abstract translation: 提供点加热器和使用其的用于清洁晶片的装置。 晶片清洗装置包括加热器卡盘，其上安装有晶片，加热器卡盘构造成加热晶片的底面; 化学液体喷嘴，被配置为在所述晶片的顶表面上喷射化学液体以进行蚀刻; 以及点加热器，其被配置为加热晶片的顶表面的点。