公开(公告)号：US20240136321A1

公开(公告)日：2024-04-25

申请号：US18477910

申请日：2023-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheolan KWON ,  Jingyu MOON

IPC: H01L23/00 ,  B23K3/02

CPC classification number: H01L24/75 ,  B23K3/025 ,  B23K2101/40 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75621

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

公开(公告)号：US20240234362A9

公开(公告)日：2024-07-11

申请号：US18477910

申请日：2023-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheolan KWON ,  Jingyu MOON

IPC: H01L23/00 ,  B23K3/02

CPC classification number: H01L24/75 ,  B23K3/025 ,  B23K2101/40 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/75621

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

公开(公告)号：US20240128097A1

公开(公告)日：2024-04-18

申请号：US18200068

申请日：2023-05-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeok KIM ,  Cheolan KWON ,  Jongkeun MOK ,  Sangho SHIN ,  Sodam JUNG ,  Kiwook HAN

IPC: H01L21/67

CPC classification number: H01L21/67132

Abstract: A chip ejector may include an ejector body and a pushing mechanism, the ejector body may include first vacuum holes, an opening and at least one second vacuum hole, the first vacuum holes may fix a film having at least one semiconductor chip using a vacuum, the opening may be formed under the semiconductor chip, the second vacuum hole may be arranged around the opening to provide a portion of the film under an edge portion of a lower surface of the semiconductor chip with the vacuum, the pushing mechanism may be lifted in the ejector body through the opening to lift up the semiconductor chip and the film, thus, a sufficiently strong downward force may be applied to the portion of the film under the edge portion of the lower surface of the semiconductor chip to readily delaminate the semiconductor chip having a thin thickness from the film.