公开(公告)号：US20240301613A1

公开(公告)日：2024-09-12

申请号：US18665186

申请日：2024-05-15

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Donggi HAN ,  Hyunjoo KIM ,  Sangho SHIN ,  Kwonchul YUN ,  Jungsang CHOI

IPC分类号： D06F58/10 ,  D06F58/20 ,  D06F73/02 ,  D06F103/02 ,  D06F105/24

CPC分类号： D06F58/10 ,  D06F58/20 ,  D06F73/02 ,  D06F2103/02 ,  D06F2105/24

摘要： A clothing management apparatus, comprising: an outer case; an inner case arrangeable inside the outer case to thereby form a clothing accommodation space; a heat exchanger; and a fan. The inner case comprises: an air supply port arrangeable on the top surface of the inner case and is for supplying the air flow to the clothing accommodation space; a first exhaust port arrangeable on a side surface between the bottom surface and the top surface of the inner case; and a second exhaust port arrangeable on the bottom surface of the inner case, wherein air introduced through the first exhaust port is discharged bypassing the heat exchanger and is directed to the fan, and air introduced through the second exhaust port is discharged by passing through the heat exchanger and directed to the fan.

公开(公告)号：US20240128097A1

公开(公告)日：2024-04-18

申请号：US18200068

申请日：2023-05-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hyeok KIM ,  Cheolan KWON ,  Jongkeun MOK ,  Sangho SHIN ,  Sodam JUNG ,  Kiwook HAN

IPC分类号： H01L21/67

CPC分类号： H01L21/67132

摘要： A chip ejector may include an ejector body and a pushing mechanism, the ejector body may include first vacuum holes, an opening and at least one second vacuum hole, the first vacuum holes may fix a film having at least one semiconductor chip using a vacuum, the opening may be formed under the semiconductor chip, the second vacuum hole may be arranged around the opening to provide a portion of the film under an edge portion of a lower surface of the semiconductor chip with the vacuum, the pushing mechanism may be lifted in the ejector body through the opening to lift up the semiconductor chip and the film, thus, a sufficiently strong downward force may be applied to the portion of the film under the edge portion of the lower surface of the semiconductor chip to readily delaminate the semiconductor chip having a thin thickness from the film.