公开(公告)号：US20230359805A1

公开(公告)日：2023-11-09

申请号：US18103868

申请日：2023-01-31

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Kihyun KIM ,  Donyun KIM ,  Nohong KWAK

IPC: G06F30/398 ,  G06T7/00 ,  G06T7/70 ,  G06F30/392 ,  G03F1/70 ,  G03F1/36

CPC classification number: G06F30/398 ,  G06T7/0006 ,  G06T7/001 ,  G06T7/70 ,  G06F30/392 ,  G03F1/70 ,  G03F1/36 ,  G06T2207/10032 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/30148 ,  G06T2207/20076

Abstract: A layout method for a semiconductor chip includes designing a layout; generating an aerial image based on the layout; determining a predicted scanning electron microscope (SEM) image based on the aerial image using a first machine learning model; determining a target SEM image based on the layout using a second machine learning model; predicting a defect in the semiconductor chip based on a result of comparing the predicted SEM image with the target SEM image; and correcting the layout based on the predicted defect.

公开(公告)号：US20230115188A1

公开(公告)日：2023-04-13

申请号：US17737494

申请日：2022-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Seoul National University R&DB Foundation

Inventor： Nohong KWAK ,  Donyun KIM ,  Kihyun KIM ,  Yunhyoung NAM

IPC: G06T7/00 ,  G06V10/762

Abstract: A pattern inspection method includes converting sample patterns of a sample image into training images, extracting feature values of the training patterns, setting feature vectors of the training patterns on the basis of the feature values, converting the feature vectors into Gaussian vectors, clustering the Gaussian vectors, thereby sorting the Gaussian vectors into clusters, selecting a select vector from each of the clusters, storing, as a pattern model, the training pattern corresponding to the select vector in a database, converting a target pattern of a target image into an inspection pattern on the basis of the pattern model, and inspecting the inspection pattern.

公开(公告)号：US20230281794A1

公开(公告)日：2023-09-07

申请号：US18150936

申请日：2023-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihyun KIM ,  Donyun KIM ,  Nohong KWAK

IPC: G06T7/00 ,  G06T7/90

CPC classification number: G06T7/001 ,  G06T7/90 ,  G06T7/0006 ,  G06T2207/10024 ,  G06T2207/10061 ,  G06T2207/30148 ,  G06T2207/20221

Abstract: In a method of classifying defects of a pattern, SEM images having different colors on the same pattern are aligned and merged. The defects of the pattern are located by color difference in the merged SEM image. The defects of the pattern are firstly located at the location of the defects. A design in which a layout of the pattern is drawn, and the merged SEM image are aligned. The defects of the pattern are secondly classified by comparing the layout of the pattern drawn in the design and the merged SEM image. A type of the defects of the pattern is determined by combination of the first and second classifications of the defects of the pattern.

公开(公告)号：US20230043003A1

公开(公告)日：2023-02-09

申请号：US17725107

申请日：2022-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Nohong KWAK ,  Donyun KIM ,  Yunhyoung NAM ,  Mincheol KANG ,  Kihyun KIM

IPC: G06T7/00 ,  G06T7/30 ,  H01J37/26

Abstract: There are provided a method of accurately detecting a measurement error of SEM equipment by comparing and aligning a design image with an SEM image, and a method of accurately aligning SEM equipment based on a detected measurement error. The method of detecting a measurement error of SEM equipment includes acquiring SEM images of a measurement target, performing pre-processing on the SEM images and design images corresponding thereto, selecting training SEM images from among the SEM images, performing training by using the training SEM images and training design images and generating a conversion model between the SEM images and the design images, converting the SEM images into conversion design images by using the conversion model, extracting an alignment coordinate value by comparing and aligning the conversion design images with the design images, and determining a measurement error of the SEM equipment based on the alignment coordinate value.