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公开(公告)号：US20240079206A1
公开(公告)日：2024-03-07
申请号：US18301568
申请日：2023-04-17
发明人： Kihyun KIM
CPC分类号： H01J37/28 , H01J37/222 , H01J2237/2817
摘要： There are provided a scanning electron microscope (SEM) measurement method and/or apparatus that reduce critical dimension (CD) dispersion according to position correction of a measurement area in CD measurement in several SEM images of the same pattern. The SEM measurement method includes obtaining individual SEM images at a plurality of locations on a wafer via an SEM, generating a merged SEM image by aligning the individual SEMs and merging the individual SEM images, generating a merged measurement area in the merged SEM image, generating, in the individual SEM images, individual measurement areas corresponding to the merged measurement area, and measuring individual critical dimensions (CDs) in the individual measurement areas.
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公开(公告)号：US20240053085A1
公开(公告)日：2024-02-15
申请号：US18384621
申请日：2023-10-27
发明人： Kihyun KIM , Seokjun SON , Ilsung BAE , Byungkwan YANG , Sungi HONG , Bongjun KWON , Jaehyun LEE
IPC分类号： F25D17/06
CPC分类号： F25D17/065
摘要： A refrigerator includes: a main body; a storage compartment provided in the main body; and an air duct provided in the storage compartment and configured to discharge air into the storage compartment, wherein the air duct may include: a front panel having an assembly groove formed at upper portion of a front surface of the front panel; an air flow path part provided at a rear surface of the front panel; an air duct cover including an upper portion inserted into the assembly groove and a lower portion attached to the front panel; and a fixing member configured to detachably attach the air duct to the front panel.
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3.发明公开公开(公告)号：US20240006391A1
公开(公告)日：2024-01-04
申请号：US18467062
申请日：2023-09-14
发明人： Sangho LEE , Kihyun KIM , Sangyong PARK , Kwanghyun BAEK , Seungjae BAEK
IPC分类号： H01L25/16 , H01L23/498 , H01L23/00 , H01L23/13 , H05K1/18
CPC分类号： H01L25/16 , H01L23/49833 , H01L24/16 , H01L23/13 , H01L23/49816 , H05K1/181 , H01L2224/16227 , H01L2924/19106 , H05K2201/10098 , H05K2201/10378 , H05K2201/10015 , H05K2201/10515 , H05K2201/10734 , H05K2201/10962 , H05K2201/10704
摘要： A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.
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公开(公告)号：US20220190609A1
公开(公告)日：2022-06-16
申请号：US17688269
申请日：2022-03-07
发明人： Kihyun KIM , Kyungha KOO , Wooram LEE , Changhyung LEE , Jihye KIM , Jihong KIM , Yunjeong NOH , Seho PARK , Kumjong SUN , Ju-Hyang LEE , Mincheol HA , Sangmoo HWANGBO
摘要： An electronic device is provided. The electronic device includes a housing, a wireless charging coil disposed inside the housing, a fan disposed inside the housing and in proximity to the coil, a temperature sensor disposed inside the housing and in proximity to the coil, a wireless charging circuit having the coil and configured to transmit power wirelessly to an external device via the coil, and a control circuit electrically connected to the fan, the temperature sensor, and the wireless charging circuit. The control circuit may be configured to receive a signal from the external device, receive data related to a temperature of the coil from the temperature sensor, and control the fan at least partially on the basis of at least one of the signal and the data.
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公开(公告)号：US20210313001A1
公开(公告)日：2021-10-07
申请号：US17073682
申请日：2020-10-19
发明人： Sungik JANG , Kihyun KIM , Soojin ANN , Chungki Lee , Dongguk HAN
IPC分类号： G11C29/38 , G11C29/44 , G11C11/4091 , H01L25/065
摘要： A memory device includes: a plurality of sense amplifier circuits sensing a data bit in response to a parallel test signal from a plurality of banks; a plurality of comparators comparing the data bit from each of the plurality of sense amplifier circuits with a test bit; and a logic circuit receiving output signals of the plurality of comparators and outputting a test result, wherein each of the plurality of comparators receives the test bit, an evolved parallel bit test (PBT) signal, at least one test ignore signal, and a test pass signal, and compares the data bit and the test bit in response to the evolved parallel bit test (PBT) signal, the at least one logic state test setting signal, and the test pass signal, and passes a corresponding bank regardless of a test operation in response to the test pass signal.
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公开(公告)号：US20210143683A1
公开(公告)日：2021-05-13
申请号：US17057234
申请日：2019-07-02
发明人： Mincheol HA , Kwangseob KIM , Kihyun KIM , Dongzo KIM , Jiwon KIM , Jihye KIM , Yunjeong NOH , Keumsu SONG , Changhak O , Kyungmin LEE , Hyungkoo CHUNG , Jongchul HONG , Yongsang YUN
摘要： Various embodiments relating to an electronic device are disclosed, and according to an embodiment, the electronic device may comprise: a plurality of coils; a first power generation circuit electrically connected to at least one of the plurality of coils; a second power generation circuit electrically connected to at least one of the plurality of coils; and a control circuit, wherein when the approach of a second external electronic device is detected while first power is provided to a first external electronic device by using a first frequency via the first power generation circuit, the control circuit allows the frequency of the second power generation circuit to be configured to a second frequency different from a first frequency in order to provide second power to the second external electronic device. Other embodiments may be possible.
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7.发明申请公开(公告)号：US20200036227A1
公开(公告)日：2020-01-30
申请号：US16447113
申请日：2019-06-20
发明人： Kwangseob KIM , Keumsu SONG , Changhak O , Dongzo KIM , Jihye KIM , Mincheol HA , Kihyun KIM , Jiwon KIM , Yunjeong NOH , Kyungmin LEE , Hyungkoo CHUNG , Jongchul HONG , Yongsang YUN
摘要： An electronic device including a wireless charging coils, and an operating method thereof are provided. The electronic device includes a housing including a concave portion couplable to a protrusion of one or more external electronic devices, a first coil stored inside the housing, a second coil stored inside the housing, and disposed between the first coil and the concave portion, a power transmission circuit including a first connecting terminal electrically coupled to the first coil and a second connecting terminal electrically coupled to the second coil, and a control circuit. The control circuit configured to check a data packet received from the external electronic device which is in proximity to the electronic device, control to transmit first designated power to the external electronic device through the first coil wirelessly, and second designated power to the external electronic device through the second coil wirelessly by using the power transmission circuit.
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公开(公告)号：US20190221579A1
公开(公告)日：2019-07-18
申请号：US16362932
申请日：2019-03-25
发明人： Kihyun KIM , Chadong Yeo
IPC分类号： H01L27/11582 , H01L27/11548 , H01L27/11575 , H01L27/1157 , H01L27/11556 , H01L27/11524
CPC分类号： H01L27/11582 , H01L27/11524 , H01L27/11548 , H01L27/11556 , H01L27/1157 , H01L27/11575 , H01L27/11578
摘要： A three-dimensional semiconductor memory device is provided. A stacked structure is formed on a substrate. The stacked structure includes conductive patterns vertically stacked on the substrate. A selection structure including selection conductive patterns is stacked on the stacked structure. A channel structure penetrates the selection structure and the stacked structure to connect to the substrate. An upper interconnection line crosses the selection structure. A conductive pad is disposed on the channel structure to electrically connect the upper interconnection line to the channel structure. A bottom surface of the conductive pad is positioned below a top surface of the uppermost selection conductive pattern of the selection conductive patterns.
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9.发明申请POLYMER, A METHOD OF PREPARING THE SAME, COMPOSITE PREPARED FROM THE POLYMER, AND ELECTRODE AND COMPOSITE MEMBRANE EACH INCLUDING THE POLYMER OR THE COMPOSITE 有权聚合物，其制备方法，由聚合物制备的复合材料，以及包括聚合物或复合材料的电极和复合膜公开(公告)号：US20150311557A1
公开(公告)日：2015-10-29
申请号：US14793112
申请日：2015-07-07
发明人： Ki-hyun KIM , Pil-won HEO , Chan-ho PAK , Jong-chan LEE , Kihyun KIM , Sung-kon KIM
CPC分类号： H01M8/1027 , C08G75/23 , C08G79/04 , H01M4/622 , H01M8/1032 , H01M8/1034 , H01M2008/1095 , H01M2300/0082 , Y02E60/521
摘要： A polymer comprising a first repeating unit represented by Formula 1: wherein R1 to R13 and Ar1 in Formula 1 are defined in the specification.
摘要翻译： 包含由式1表示的第一重复单元的聚合物：其中式1中的R 1至R 13和Ar 1在说明书中定义。
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公开(公告)号：US20230146752A1
公开(公告)日：2023-05-11
申请号：US18153049
申请日：2023-01-11
发明人： Dongzo KIM , Mincheol HA , Kihyun KIM , Yunjeong NOH , Keyic SON , Taehyeon YU , Hyungkoo CHUNG
CPC分类号： H01F27/2885 , H02J50/402 , H02J50/70 , H02J50/10 , H02J50/005 , H01F27/2823
摘要： A wireless power transmission apparatus is provided. The wireless power transmission apparatus includes a first coil including a first conductive wire area formed of an arrangement of conductive wires, and a first opening area surrounded by the first conductive wire area, a second coil including a second conductive wire area formed of an arrangement of conductive wires, and a second opening area surrounded by the second conductive wire area, a first overlapping area formed by overlapping a portion of the first conductive wire area with a portion of the second opening area, and a first shielding member disposed on at least a portion of the first overlapping area, wherein the first shielding member may be configured to at least partially block an electromagnetic field generated by the second coil interfering in the first conductive wire area.
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