公开(公告)号：US20200242066A1

公开(公告)日：2020-07-30

申请号：US16734844

申请日：2020-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KYUNGSOO LEE ,  JAEWON LEE ,  JUNHO HUH ,  HELIN LIN

IPC: G06F13/40 ,  G06F13/42 ,  G06F13/24 ,  G06F9/4401

Abstract: A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.