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公开(公告)号：US20240282672A1
公开(公告)日：2024-08-22
申请号：US18389251
申请日：2023-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： BONGWEE YU , KYOUNG -MIN LEE , KYUNGSOO LEE , JUNHO HUH
IPC: H01L23/48 , H01L23/00 , H01L23/528 , H01L25/10 , H10B80/00
CPC classification number: H01L23/481 , H01L23/528 , H01L24/16 , H01L25/105 , H10B80/00 , H01L24/14 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225
Abstract: A semiconductor device includes: a package substrate; a first die on the package substrate and including a hard macro and through silicon vias; and a second die on the first die, wherein the first die includes a first region, which does not include the hard macro, and a second region including a macro-region that includes the hard macro, wherein the through silicon vias of the first region are arranged in a first direction with a first distance and in a second direction with a second distance, wherein the through silicon vias of the second region are arranged in the first direction with a first pitch, and in the second direction with a second pitch, wherein the macro-region is interposed between the through silicon vias arranged in the first direction, wherein the first pitch is greater than the first distance, and wherein the second pitch is less than the second distance.
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公开(公告)号：US20210173438A1
公开(公告)日：2021-06-10
申请号：US17021254
申请日：2020-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KYUNGSOO LEE , Hyunsang Park
Abstract: A foldable electronic device includes a first sub-device, a second sub-device, a first hinge connected with the first and second sub-devices, and a single display panel coupled to the first and second sub-devices; where the single display panel includes a main area formed on inner surfaces of the first and second sub-devices, a cover area formed on a first outer surface of the first sub-device, and a round-edge area placed on a first side surface of the first sub-device, and configured to connect the main area and the cover area; where, in a folded state of the foldable electronic device, first information is displayed through the cover area or the round-edge area; and, in an unfolded state of the foldable electronic device, second information is displayed through the main area or the round-edge area.
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Patent Agency Ranking
公开(公告)号：US20190229100A1
公开(公告)日：2019-07-25
申请号：US16056709
申请日：2018-08-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： YUNHYEOK IM , KYOUNG-MIN LEE , KYUNGSOO LEE , HORANG JANG
IPC: H01L25/10 , H01L23/498 , H01L23/367 , H01L23/42
Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interpose between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.
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公开(公告)号：US20220083116A1
公开(公告)日：2022-03-17
申请号：US17536778
申请日：2021-11-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KYUNGSOO LEE , TAEKKYUN SHIN
IPC: G06F1/324 , G06N3/02 , G06F1/3293 , G06N20/00
Abstract: A context hub receives and processes data from multiple sensors. An operation method of the context hub includes identifying a pattern of context data input to the context hub from at least one of the sensors, determining a dynamic voltage-frequency scaling (DVFS) level corresponding to the identified pattern of the context data, and processing, at the context hub, the context data by using a clock signal or a driving voltage corresponding to the determined DVFS level.
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公开(公告)号：US20200251455A1
公开(公告)日：2020-08-06
申请号：US16854971
申请日：2020-04-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： YUNHYEOK IM , KYOUNG-MIN LEE , KYUNGSOO LEE , HORANG JANG
IPC: H01L25/10 , H01L23/42 , H01L23/498 , H01L23/367 , H01L23/538 , H01L23/552
Abstract: A semiconductor package includes a bottom package having a lower substrate and a lower semiconductor chip mounted on the lower substrate, an interposer substrate on the bottom package, a first top package and a second top package that are mounted on the interposer substrate, and a heat spreader that is interposed between the first top package and the second top package and separates the first and second top packages from each other. The heat spreader is adhered to the interposer substrate through a plurality of first connection terminals.
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公开(公告)号：US20200242066A1
公开(公告)日：2020-07-30
申请号：US16734844
申请日：2020-01-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KYUNGSOO LEE , JAEWON LEE , JUNHO HUH , HELIN LIN
IPC: G06F13/40 , G06F13/42 , G06F13/24 , G06F9/4401
Abstract: A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.
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公开(公告)号：US20190250691A1
公开(公告)日：2019-08-15
申请号：US16107970
申请日：2018-08-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： KYUNGSOO LEE , TAEKKYUN SHIN
CPC classification number: G06F1/324 , G06F1/3293 , G06N3/02 , G06N20/00
Abstract: A context hub receives and processes data from multiple sensors. An operation method of the context hub includes identifying a pattern of context data input to the context hub from at least one of the sensors, determining a dynamic voltage-frequency scaling (DVFS) level corresponding to the identified pattern of the context data, and processing, at the context hub, the context data by using a clock signal or a driving voltage corresponding to the determined DVFS level.
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