公开(公告)号：US20220379432A1

公开(公告)日：2022-12-01

申请号：US17745618

申请日：2022-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HOSEOP CHOI ,  MINSEOP PARK ,  JUBONG LEE ,  SUNG YONG PARK ,  KIJU SOHN ,  JAEYOUNG EOM

IPC: B24B53/017

Abstract: A conditioning disk replacement apparatus includes; a detacher configured to separate a conditioning disk from to a holder, a transfer part configured to transfer the conditioning disk, and a container configured to store the conditioning disk. The detacher includes a detachment body and a rotary part coupled to the detachment body, the rotary part includes a key protruding outward from the rotary part in a first horizontal direction, and the rotary part is configured to rotate about a central axis extending in the first horizontal direction.

公开(公告)号：US20220068659A1

公开(公告)日：2022-03-03

申请号：US17184279

申请日：2021-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHANYEONG JEONG ,  HOSEOP CHOI ,  SUNGGIL KANG ,  DONGKYU SHIN ,  SANGJIN AN

IPC: H01L21/324 ,  H01L21/67 ,  H01L21/311 ,  H01J37/32

Abstract: A wafer processing method includes supplying a first process gas into a wafer processing apparatus, lowering a temperature of the wafer, generating plasma using the first process gas, supplying a second process gas and mixing the second process gas with the plasma, performing a plasma process on the wafer using the plasma and the second process gas, and performing an annealing process on the wafer on which the plasma process has been performed. The lowering of the temperature of the wafer includes increasing an internal pressure of the wafer processing apparatus.