公开(公告)号：US20240170449A1

公开(公告)日：2024-05-23

申请号：US18213018

申请日：2023-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYOUNGJOO LEE ,  SANG-SICK PARK ,  CHUNGSUN LEE ,  SEUNGYOON JUNG

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/83 ,  H01L24/08 ,  H01L24/09 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0801 ,  H01L2224/0903 ,  H01L2224/09517 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81097 ,  H01L2224/81203 ,  H01L2224/83097 ,  H01L2224/83203 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2924/351

Abstract: A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.