公开(公告)号：US20130234310A1

公开(公告)日：2013-09-12

申请号：US13651752

申请日：2012-10-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Han-Shin Youn ,  Kyong-Soon Cho

IPC: H01L23/48 ,  H01L21/60

CPC classification number: H01L23/36 ,  G01N29/0681 ,  H01L21/56 ,  H01L22/12 ,  H01L23/3128 ,  H01L23/3185 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/14131 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29011 ,  H01L2224/32221 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A flip chip package may include package substrate, a semiconductor chip, conductive bumps, a molding member and a heat sink. The semiconductor chip may be arranged over an upper surface of the package substrate. The conductive bumps may be interposed between a lower surface of the semiconductor chip and the upper surface of the package substrate to electrically connect the semiconductor chip and the package substrate with each other. The molding member may be formed on the upper surface of the package substrate to cover the semiconductor chip. The heat sink may make contact with the semiconductor chip to dissipate a heat in the semiconductor chip. An ultrasonic wave may pass through only one interface between the semiconductor chip and the molding member, so that scattering of the ultrasonic wave may be suppressed.

Abstract translation: 倒装芯片封装可以包括封装衬底，半导体芯片，导电凸块，模制构件和散热器。 半导体芯片可以布置在封装衬底的上表面上。 导电凸块可以插入在半导体芯片的下表面和封装基板的上表面之间，以将半导体芯片和封装基板彼此电连接。 模制构件可以形成在封装衬底的上表面上以覆盖半导体芯片。 散热器可以与半导体芯片接触以在半导体芯片中散热。 超声波可以仅穿过半导体芯片和模制构件之间的一个界面，从而可以抑制超声波的散射。