公开(公告)号：US10921858B2

公开(公告)日：2021-02-16

申请号：US15239419

申请日：2016-08-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonwoo Kim ,  Hosaeng Kim ,  Hoon Park ,  Jinwoo Jung

IPC: G06F1/16 ,  H05K5/04 ,  H01Q1/24 ,  H05K5/00 ,  H01Q1/44 ,  H04M1/02 ,  H04B1/3888

Abstract: An apparatus is provided. The apparatus includes a case forming at least one portion of a surface of the apparatus, the at least one portion of the surface including a first metal portion, a second metal portion, and a non-metal portion disposed between the first and second metal portions; and a touchscreen display at least partially housed in the case.

公开(公告)号：US09413080B2

公开(公告)日：2016-08-09

申请号：US14532235

申请日：2014-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoon Park ,  Yeon-Woo Kim ,  Ho-Saeng Kim

IPC: H01Q1/24 ,  H01Q21/30 ,  H01Q9/42

CPC classification number: H01Q1/243 ,  H01Q7/00 ,  H01Q9/42 ,  H01Q21/30

Abstract: An electronic apparatus is provided. The electronic apparatus includes at least one first antenna radiator, a main board including a feed part that is spaced apart from at least one portion of the at least one first antenna radiator to overlap the at least one portion of the at least one first antenna radiator and feeds an electric current to the at least one first antenna radiator according to an indirect feed method, at least one second antenna radiator disposed on a housing of the electronic apparatus, at least one first connection member for electrically connecting the at least one first antenna radiator to the at least one second antenna radiator, and at least one second connection member for electrically connecting a ground part formed on the main board to the at least one second antenna radiator. Also, other various exemplary may be implemented.

Abstract translation: 提供电子设备。 电子设备包括至少一个第一天线辐射器，主板包括馈送部分，该馈电部分与至少一个第一天线辐射器的至少一部分间隔开，以与至少一个第一天线辐射器的至少一部分重叠 并且根据间接馈送方法将电流馈送到所述至少一个第一天线辐射器，设置在所述电子设备的壳体上的至少一个第二天线辐射器，至少一个第一连接构件，用于将所述至少一个第一天线 散热器连接到至少一个第二天线辐射器，以及至少一个第二连接构件，用于将形成在主板上的接地部分电连接到至少一个第二天线辐射器。 此外，可以实现其他各种示例。

公开(公告)号：US10263339B2

公开(公告)日：2019-04-16

申请号：US15216858

申请日：2016-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Min Kim ,  Hoon Park ,  Il Seong ,  Woo Sung Lee

IPC: H01Q9/04 ,  A61B6/00 ,  H01Q21/30 ,  H01Q5/378 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q9/42 ,  G03B42/02 ,  H01Q5/392 ,  H01Q1/36 ,  H01Q21/28

Abstract: The X-ray detector includes a side frame; a cover coupled to an outside of the side frame; a first antenna radiator supplied with a power by being coupled to the side frame; and a second antenna radiator provided in the cover while being spaced apart from the first antenna radiator, and configured to resonate with the first antenna radiator.

公开(公告)号：US10135121B2

公开(公告)日：2018-11-20

申请号：US15478330

申请日：2017-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoon Park ,  Ho-Saeng Kim ,  Yeon-Woo Kim ,  Seong-Tae Jeong ,  Sang-Min Han

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/48

Abstract: An antenna device of a portable device such as a smartphone includes a connecting member having a conductive case and mounted on a circuit board of the portable device in a manner such that the case is connected to a ground surface of the circuit board; a radiator spaced from the circuit board; and at least one connecting pin provided between the case and the radiator. The radiator is connected to the ground surface through the connecting pin and the case. The antenna device advantageously may be easily installed in the internal space of a miniaturized, lightened and/or slimmed portable device by practically using a conductive component, e.g., the case, of the connecting member.

公开(公告)号：US09647321B2

公开(公告)日：2017-05-09

申请号：US14101550

申请日：2013-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoon Park ,  Ho-Saeng Kim ,  Yeon-Woo Kim ,  Seong-Tae Jeong ,  Sang-Min Han

IPC: H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/48

Abstract: An antenna device of a portable device such as a smartphone includes a connecting member having a conductive case and mounted on a circuit board of the portable device in a manner such that the case is connected to a ground surface of the circuit board; a radiator spaced from the circuit board; and at least one connecting pin provided between the case and the radiator. The radiator is connected to the ground surface through the connecting pin and the case. The antenna device advantageously may be easily installed in the internal space of a miniaturized, lightened and/or slimmed portable device by practically using a conductive component, e.g., the case, of the connecting member.

公开(公告)号：US09442515B2

公开(公告)日：2016-09-13

申请号：US14528564

申请日：2014-10-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonwoo Kim ,  Hosaeng Kim ,  Hoon Park ,  Jinwoo Jung

IPC: G06F1/16 ,  H01Q1/24 ,  H01Q1/44 ,  H04M1/02

CPC classification number: G06F1/1656 ,  G06F1/1613 ,  G06F1/1643 ,  G06F1/169 ,  G06F1/1698 ,  H01Q1/24 ,  H01Q1/243 ,  H01Q1/44 ,  H04B1/3888 ,  H04M1/0202 ,  H05K5/0004 ,  H05K5/04

Abstract: A case including metal for an electronic device and an electronic device having the same are provided. The electronic device includes a case comprising an injection-molded part including a plurality of holes, and a metal part formed under the injection-molded part, and the metal part being partially exposed through the plurality of holes. The metal part is divided into a plurality of parts via a cut portion formed in a portion of the metal part not exposed through the plurality of holes, and at least one of the plurality of the divided metal parts is utilized as a component element related to a specific function of the electronic device.

Abstract translation: 提供了一种包括用于电子设备的金属和具有该金属的电子设备的壳体。 该电子装置包括：包括多个孔的注射成型部的壳体和形成在注射成型部下方的金属部，该金属部通过多个孔部分露出。 金属部分经由形成在未暴露在多个孔中的金属部分的部分中的切割部分分成多个部分，并且多个分割的金属部分中的至少一个被用作与 电子设备的具体功能。

公开(公告)号：US10833088B2

公开(公告)日：2020-11-10

申请号：US16805585

申请日：2020-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Hyun Im ,  Daehyun Kim ,  Hoon Park ,  Jae-Hong Seo ,  Chunhyung Chung ,  Jae-Joong Choi

IPC: H01L29/49 ,  H01L27/108 ,  H01L21/283 ,  H01L29/423 ,  H01L21/28 ,  H01L29/66 ,  H01L29/51 ,  H01L21/8234

Abstract: A method of fabricating a semiconductor memory device includes etching a substrate that forms a trench that crosses active regions of the substrate, forming a gate insulating layer on bottom and side surfaces of the trench, forming a first gate electrode on the gate insulating layer that fills a lower portion of the trench, oxidizing a top surface of the first gate electrode where a preliminary barrier layer is formed, nitrifying the preliminary barrier layer where a barrier layer is formed, and forming a second gate electrode on the barrier layer that fills an upper portion of the trench.

公开(公告)号：US09819073B2

公开(公告)日：2017-11-14

申请号：US15216379

申请日：2016-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoon Park ,  Yeon-Woo Kim ,  Ho-Saeng Kim

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q21/30 ,  H01Q9/42 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  H01Q7/00 ,  H01Q9/42 ,  H01Q21/30

Abstract: An electronic apparatus is provided. The electronic apparatus includes at least one first antenna radiator, a main board including a feed part that is spaced apart from at least one portion of the at least one first antenna radiator to overlap the at least one portion of the at least one first antenna radiator and feeds an electric current to the at least one first antenna radiator according to an indirect feed method, at least one second antenna radiator disposed on a housing of the electronic apparatus, at least one first connection member for electrically connecting the at least one first antenna radiator to the at least one second antenna radiator, and at least one second connection member for electrically connecting a ground part formed on the main board to the at least one second antenna radiator. Also, other various exemplary may be implemented.

公开(公告)号：US09190714B2

公开(公告)日：2015-11-17

申请号：US14618182

申请日：2015-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Jin Eom ,  Hoon Park ,  Ho-Saeng Kim ,  Austin Kim ,  Yong-Jin Kim ,  Chi-Hyung Ahn

IPC: H01Q1/24 ,  H01Q9/42 ,  H01Q13/16 ,  H01Q5/25 ,  H01Q5/378 ,  H01Q5/40 ,  H01Q5/00 ,  H01Q7/00

CPC classification number: H01Q1/243 ,  H01Q5/25 ,  H01Q5/378 ,  H01Q5/40 ,  H01Q7/00 ,  H01Q9/42 ,  H01Q13/16

Abstract: An antenna device attains good antenna performance using at least one or more metal members installed in a portable terminal. The antenna device includes a main board equipped with a power supply part for supplying power, a slot part which is positioned in at least one or more metal members or is formed by a combination of the metal members, and a power supply antenna member for receiving power from the power supply part and which is electromagnetically coupled with the slot part.

公开(公告)号：US10373959B2

公开(公告)日：2019-08-06

申请号：US16050848

申请日：2018-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Hyun Im ,  Daehyun Kim ,  Hoon Park ,  Jae-Hong Seo ,  Chunhyung Chung ,  Jae-Joong Choi

IPC: H01L29/423 ,  H01L27/108 ,  H01L21/283 ,  H01L21/28 ,  H01L29/66 ,  H01L29/49 ,  H01L21/8234

Abstract: A method of fabricating a semiconductor memory device includes etching a substrate that forms a trench that crosses active regions of the substrate, forming a gate insulating layer on bottom and side surfaces of the trench, forming a first gate electrode on the gate insulating layer that fills a lower portion of the trench, oxidizing a top surface of the first gate electrode where a preliminary barrier layer is formed, nitrifying the preliminary barrier layer where a barrier layer is formed, and forming a second gate electrode on the barrier layer that fills an upper portion of the trench.