METHOD OF MANUFACTURING GALLIUM NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE
    1.
    发明申请
    METHOD OF MANUFACTURING GALLIUM NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    制造基于氮化镓的半导体发光器件的方法

    公开(公告)号:US20130302930A1

    公开(公告)日:2013-11-14

    申请号:US13887102

    申请日:2013-05-03

    CPC classification number: H01L33/0075 H01L33/32

    Abstract: A method of manufacturing a gallium nitride (GaN)-based semiconductor light emitting device is provided. A light emitting structure is formed and includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer formed of a nitride semiconductor containing gallium (Ga) on a substrate. A metal layer is disposed on the p-type semiconductor layer, and a heat treatment is performed to form a gallium(Ga)-metal compound. The gallium(Ga)-metal compound formed on the p-type semiconductor layer is removed. An electrode is disposed on an upper surface of the p-type semiconductor layer from which the gallium(Ga)-metal compound has been removed. The forming of the gallium(Ga)-metal compound includes forming a gallium vacancy in a surface of the p-type semiconductor layer.

    Abstract translation: 提供一种制造基于氮化镓(GaN)的半导体发光器件的方法。 形成发光结构,并且包括由在基板上含有镓(Ga)的氮化物半导体形成的n型半导体层,有源层和p型半导体层。 金属层设置在p型半导体层上,进行热处理以形成镓(Ga) - 金属化合物。 除去形成在p型半导体层上的镓(Ga) - 金属化合物。 电极被设置在去除了镓(Ga) - 金属化合物的p型半导体层的上表面上。 镓(Ga) - 金属化合物的形成包括在p型半导体层的表面形成镓空位。

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