OPERATIONAL AMPLIFIER COMPENSATING FOR OFFSET VOLTAGE, GAMMA CIRCUIT AND SOURCE DRIVER INCLUDING SAME

    公开(公告)号:US20210366344A1

    公开(公告)日:2021-11-25

    申请号:US17090720

    申请日:2020-11-05

    IPC分类号: G09G3/20 H03F3/45

    摘要: An operational amplifier includes an input stage with a first main input unit, a first auxiliary input unit, a second main input unit and a second auxiliary input unit, an amplification stage with a first current mirror receiving currents from the first main input unit and the first auxiliary input unit, and a second current mirror receiving currents from the second main input unit and the second auxiliary input unit, an output stage receiving voltages from the first current mirror and the second current mirror, a voltage storage unit storing an intermediate voltage based on an output signal generated by the output stage during at least one of a first operation period and a second operation period, and a switching unit that differently controls a first feedback path between the output stage and the input stage and a second feedback path between the output stage to the voltage storage unit in accordance with the first operation period and the second operation period.

    SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20240172371A1

    公开(公告)日:2024-05-23

    申请号:US18226568

    申请日:2023-07-26

    摘要: A semiconductor package includes a first structure, a second structure, a plurality of first connection members including SnBi; a plurality of second connection members including SAC (Sn, Ag and Cu). Each first connection member of the plurality of first connection members has a first surface and a second surface opposite each other, and the first surface of each first connection member of the plurality of first connection members is bonded to the first structure. A third surface of each second connection member of a plurality of second connection members is bonded to a corresponding second surface of a respective first connection member, and for each second connection member, a fourth surface of the second connection member that is opposite the third surface of the second connection member is bonded to the second structure. The third surface of each second connection member is flat, and a diameter of each second connection member decreases in a direction receding from the third surface of each second connection member.