公开(公告)号：US09099630B2

公开(公告)日：2015-08-04

申请号：US14042123

申请日：2013-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Oh Ahn ,  Jin Se Kim ,  Chang Ho Shin ,  Seok Chan Hong

IPC: H01L33/38 ,  H01L33/62 ,  H05K1/11 ,  H01L33/48 ,  H05K3/34

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H05K1/111 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The present application provides an electronic apparatus including a substrate including a first electrode pad, a second electrode pad and an intermediate pad each disposed on one surface of the substrate and separated from one another. An electronic device is disposed on the substrate and including a first electrode unit and a second electrode unit. The first electrode unit has an adhesion surface facing the first electrode pad and the intermediate pad. The second electrode unit has an adhesion surface facing the second electrode pad.

Abstract translation: 本申请提供了一种电子设备，包括：衬底，其包括第一电极焊盘，第二电极焊盘和中间焊盘，每个衬垫设置在衬底的一个表面上并彼此分离。 电子设备设置在基板上并且包括第一电极单元和第二电极单元。 第一电极单元具有面向第一电极焊盘和中间焊盘的粘合表面。 第二电极单元具有面向第二电极焊盘的粘附表面。