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    Electronic device including antenna structure
    1.
    发明授权
    Electronic device including antenna structure 有权

    公开(公告)号：US11942677B2

    公开(公告)日：2024-03-26

    申请号：US17518951

    申请日：2021-11-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： In Nam ,  Youngkon Lim ,  Jongdoo Kim

    IPC: H04M1/02 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q7/00 ,  H04B1/03 ,  H04B1/08

    CPC classification number: H01Q1/243 ,  H01Q1/02 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q7/00

    Abstract: An electronic device is provided. The electronic device includes a housing, a substrate disposed in an internal space of the housing, a battery disposed on a plane identical with a plane of the substrate, a support structure disposed to at least partially overlap the substrate when the substrate is viewed from a top, an antenna structure configured to include a dielectric substrate and at least one coil member disposed in the dielectric substrate as an antenna disposed to at least partially overlap the battery when the battery is viewed from the top, a tape member configured to include a first region at least partially overlapping the support structure, a second region at least partially overlapping the antenna structure, and a connection part connecting the first region and the second region when the support structure is viewed from the top. The dielectric substrate may include at least one extension part extended from the dielectric substrate and configured to at least partially overlap the connection part when the antenna structure is viewed from the top. The at least one extension part may include a plurality of dummy patterns formed at designated intervals and/or in a designated shape.

    Electronic device including circuit board placed adjacent to frame made of conductive material
    2.
    发明授权
    Electronic device including circuit board placed adjacent to frame made of conductive material 有权

    公开(公告)号：US12047522B2

    公开(公告)日：2024-07-23

    申请号：US17673216

    申请日：2022-02-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sanguk Kim ,  Jongdoo Kim ,  Hyoseok Na ,  Daeseung Park ,  Wanjae Ju

    IPC: H05K5/00 ,  H04M1/02

    CPC classification number: H04M1/0249 ,  H04M1/0216

    Abstract: An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.

    METHOD OF DESIGNING LAYOUT OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明公开
    METHOD OF DESIGNING LAYOUT OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20230290686A1

    公开(公告)日：2023-09-14

    申请号：US18061789

    申请日：2022-12-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yeojin NA ,  Juyun Park ,  Jongdoo Kim

    IPC: H01L21/8234 ,  G06F30/392 ,  G06F30/398

    CPC classification number: H01L21/823412 ,  H01L21/823418 ,  G06F30/392 ,  G06F30/398

    Abstract: A method of designing a layout of a semiconductor device includes forming a second layout by analyzing a first layout and correcting at least a portion of a plurality of filler cells, wherein the forming the second layout includes detecting transition regions due to a difference in width by respectively comparing a first width of a first active line and a second width of a second active line with a width of a dummy active line, in the first layout; and correcting the dummy active line of the first filler cell by analyzing the detected transition regions, wherein, in the correcting the dummy active line of the first filler cell, the dummy active line is corrected to be a corrected dummy active line having the same width as an active line having a narrower width, among the first and second active lines.

    Electronic device including fingerprint recognition module provided with conductive pattern
    4.
    发明授权
    Electronic device including fingerprint recognition module provided with conductive pattern 有权

    公开(公告)号：US11157713B2

    公开(公告)日：2021-10-26

    申请号：US16711834

    申请日：2019-12-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jongdoo Kim ,  Jaerok Cho ,  Wanjae Ju

    IPC: G06K9/00 ,  G06F3/041 ,  G06F21/32

    Abstract: Disclosed is an electronic device. An electronic device according to various embodiments may include: a housing including a front face and a rear face opposite the front face; a transparent plate defining the front face of the housing; a display panel disposed below the transparent plate; a fingerprint sensor disposed between the display panel and the rear face of the housing and configured to acquire biometric information about an external object that is within a specified proximity of the transparent plate; and a conductive pattern disposed adjacent to the fingerprint sensor and configured to detect whether the external object is within a specified proximity of the fingerprint sensor.

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