SEMICONDUCTOR DEVICE INCLUDING DIFFERENT CONDUCTIVE LINES

    公开(公告)号:US20240090202A1

    公开(公告)日:2024-03-14

    申请号:US18243731

    申请日:2023-09-08

    Abstract: A semiconductor device includes a lower structure, an interlayer insulating layer on the lower structure, a conductive shielding line on the lower structure and penetrating through the interlayer insulating layer, a capping insulating layer on the interlayer insulating layer and the conductive shielding line, and a bit line on the lower structure and penetrating through the capping insulating layer and the interlayer insulating layer. An upper surface of the bit line is at a higher level than an upper surface of the conductive shielding line. A lower surface of the bit line is at a level equal to or lower than a level of a lower surface of the conductive shielding line.

    ELECTRONIC DEVICE HAVING COMBINED BUTTON
    3.
    发明申请

    公开(公告)号:US20180157411A1

    公开(公告)日:2018-06-07

    申请号:US15827332

    申请日:2017-11-30

    Abstract: An electronic device may include a housing including a first surface facing a first direction and a second surface facing a second direction, the first direction being opposite that of the second direction, the first surface including a first opening and a second opening; a touch screen display being disposed and visible through the first opening; a mechanical button located at least in part of the second opening and movable in response to a pressure applied thereto; a processor located inside the housing and electrically coupled to the display and the mechanical button; and a memory located inside the housing and electrically coupled to the processor, wherein the memory stores a plurality of instructions that cause, upon execution, the processor to: display a screen on at least a portion of the touch screen display; display a virtual button comprising a graphical user interface (GUI) on a specific region of the screen adjacent to the mechanical button such that the GUI visually extends the mechanical button.

    SEMICONDUCTOR MEMORY DEVICE
    6.
    发明公开

    公开(公告)号:US20240074139A1

    公开(公告)日:2024-02-29

    申请号:US18143314

    申请日:2023-05-04

    CPC classification number: H10B12/033 H01L29/7827 H10B12/315

    Abstract: A semiconductor memory device including a substrate, a plurality of conductive lines extending in a first horizontal direction on the substrate and spaced apart from each other in a second horizontal direction perpendicular to the first horizontal direction, a first cell stack on each of the plurality of conductive lines and including a plurality of first vertical transistor structures and a plurality of first connection contacts, a second cell stack on the first cell stack and including a plurality of second vertical transistor structures and a plurality of second connection contacts, and a plurality of capacitor structures arranged on the second cell stack and connected to the plurality of first vertical transistor structures and the plurality of second vertical transistor structures.

    ELECTRONIC DEVICE AND FINGERPRINT AUTHENTICATION INTERFACE METHOD THEREOF

    公开(公告)号:US20190266374A1

    公开(公告)日:2019-08-29

    申请号:US16285445

    申请日:2019-02-26

    Abstract: The disclosed electronic device may include a front plate and a rear plate, a touch screen display exposed through a part of the front plate, a fingerprint sensor disposed to overlap a region of the display when viewed from above the front plate, a processor operatively connected to the display and the fingerprint sensor, and a memory operatively connected to the processor. the memory may store instructions that, when executed by the processor, control the electronic device to display a user interface including a first object at a first location of the display, to obtain a gesture input to drag the first object from the first location to the region, to move the first object to the region depending on the gesture input, and to perform authentication using the fingerprint sensor based on the finger being located on the region.

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