公开(公告)号：US20230282674A1

公开(公告)日：2023-09-07

申请号：US18117201

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Haewook JEONG ,  Wonseok LEE ,  Minchul LEE ,  Masamichi ITO

IPC: H01L27/146

CPC classification number: H01L27/14643 ,  H01L27/14614 ,  H01L27/1464

Abstract: An image sensor is provided. The image sensor includes: a semiconductor substrate including a first surface and a second surface, which are opposite to each other; a photoelectric conversion region in the semiconductor substrate; a vertical transfer gate, which extends into the semiconductor substrate from the first surface toward the photoelectric conversion region; a floating diffusion region, which is provided in the semiconductor substrate, is spaced apart from the vertical transfer gate, and is an n-type impurity region; and a second impurity region, which is provided between the vertical transfer gate and the floating diffusion region and is a p-type impurity region.

公开(公告)号：US20220093665A1

公开(公告)日：2022-03-24

申请号：US17328249

申请日：2021-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heegeun PARK ,  Kyungho LEE ,  Jangho MOON ,  Minchul LEE ,  Soyoung JEONG

IPC: H01L27/146

Abstract: Disclosed is an image sensor comprising a subtrate that includes a plurality of pixel groups each including a plurality of pixel regions, a plurality of color filters two-dimensionally arraned on a first surface of the substrate, and a pixel separation structure in the substrate. The pixel separation structure includes a first part that defines each of the pixel regions and a second part connected to the first part. The second part runs across an inside of each of the pixel regions.

公开(公告)号：US20180273816A1

公开(公告)日：2018-09-27

申请号：US15933630

申请日：2018-03-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minchul LEE ,  Namil KOO ,  Kyungrim KIM ,  Sun-Woo PARK ,  Yongin PARK ,  Min-Woo LEE ,  Wonhee CHOE ,  Hun Rae KIM ,  Dong-Sel KIM ,  Zeeyoung LEE

IPC: C09J183/10 ,  C09J133/06 ,  C08J3/24 ,  C08F20/18 ,  H01L21/02 ,  C08K3/36

CPC classification number: C09J183/10 ,  C08F20/18 ,  C08F220/18 ,  C08F2500/01 ,  C08J3/246 ,  C08K3/36 ,  C09J133/06 ,  C09J133/08 ,  H01L21/02118 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F2220/1875 ,  C08F220/20 ,  C08L83/06

Abstract: Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.

公开(公告)号：US20190019000A1

公开(公告)日：2019-01-17

申请号：US15978586

申请日：2018-05-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minchul LEE ,  Kwanhee LEE ,  Daeyoung CHUNG ,  Sanghyun CHO ,  Wonho CHO ,  Hayoung KO ,  Jongsung LEE ,  Heechang HWANG

IPC: G06K9/00 ,  H01L25/16 ,  G02B5/20 ,  G06F21/32 ,  G06F3/041 ,  G02B27/09

Abstract: An optics-based fingerprint sensor may include a first photodiode, a first metal shield structure that is formed on the first photodiode and includes a first opening, a first color filter structure that is formed on the first metal shield structure and including a second opening exposing the first opening, a second photodiode that is spaced apart from the first photodiode by a predetermined distance, a first nano-optical filter structure that is formed on the second photodiode, and a first band limit filter structure that is formed on the nano-optical filter structure.