摘要:
A fiber scanning optical probe including: an optical fiber; an actuator that drives the optical fiber in two directions; and an asymmetric structure that is disposed at one end of the optical fiber.
摘要:
An ultrasonic probe includes an optical resonating waveguide configured to receive an echo ultrasound signal; a calculator configured to calculate an acoustic pressure of the echo ultrasound signal, based on a change in wavelength of an optical signal traveling within the optical resonating waveguide, the change occurring in response to the optical resonating waveguide receiving the echo ultrasound signal; and a converter configured to convert the echo ultrasound signal to an electric signal based on the acoustic pressure of the echo ultrasound signal.
摘要:
An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.
摘要:
A ultrasonic probe including: a case including: an opening; and a coupling portion; and a probe lens comprising: a first portion being exposed through the opening and a second portion coupled to the coupling portion of the case, wherein one of the coupling portion of the case and the second portion of the probe lens comprises a groove, and other one of the coupling portion of the case and the second portion of the probe lens comprises a shape matching the groove to couple the case and the probe lens to each other.
摘要:
Disclosed herein is an ultrasound probe including a transducer array configured to generate ultrasonic waves, an integrated circuit disposed on a back surface of the transducer array by using an adhesive member, a printed circuit board connected to the integrated circuit and configured to output a signal to the integrated circuit, and a pad bridge disposed on front surfaces of the printed circuit board and the integrated circuit by using the adhesive member and configured to electrically connect the printed circuit board with the integrated circuit. An area of a region of the ultrasound probe contacting the human body may be reduced without reducing the size of the transducer array, and the integrated circuit and the printed circuit board may be integrally connected by using the adhesive member.