公开(公告)号：US20240321775A1

公开(公告)日：2024-09-26

申请号：US18614285

申请日：2024-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shlege LEE ,  Hyunggil BAEK ,  Minwoo CHO

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/64 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/562 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/642 ,  H01L25/105 ,  H10B80/00 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package comprises: a first package substrate; a semiconductor device mounted on a first surface of the first package substrate and connected to the first package substrate; a plurality of connection pads on a second surface of the first package substrate; a plurality of external connection terminals respectively disposed on one or more connection pads of the plurality of connection pads; a plurality of passive elements mounted on one or more connection pads of the plurality of connection pads in which the plurality of external connection terminals are not disposed; and a floating structure disposed between at least one passive element from the plurality of passive elements and at least one external connection terminal from the plurality of external connection terminals, spaced apart from the at least one passive element and the at least one external connection terminal, and disposed on the second surface of the first package substrate.