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    AIR CONDITIONER AND CONTROL METHOD THEREOF
    1.
    发明申请
    AIR CONDITIONER AND CONTROL METHOD THEREOF 审中-公开

    公开(公告)号：US20200088430A1

    公开(公告)日：2020-03-19

    申请号：US16575567

    申请日：2019-09-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho LEE ,  Chang Yong LEE ,  Jae Hun HUR ,  Min CHANG ,  Dae Chul HAN ,  Jong Won BAK ,  Hyeong Joon SEO ,  Dong Il JUNG

    IPC: F24F11/30 ,  F24F11/56 ,  F24F11/61 ,  F24F11/64 ,  F24F11/67 ,  G05B19/042

    Abstract: Disclosed herein is an air conditioner and control method of determining duration to be maintained at a reference temperature of a mode change based on an outdoor temperature. The air conditioner includes a compressor, an outdoor heat exchanger, an indoor heat exchanger, a four-way valve configured to guide refrigerant compressed in the compressor to either the outdoor heat exchanger or the indoor heat exchanger according to a cooling mode or a heating mode, and a controller configured to determine duration corresponding to a measured outdoor temperature, change the heating mode to the cooling mode when the measured indoor temperature is maintained at a first reference indoor temperature or greater for the determined duration, and change the cooling mode to the heating mode when a measured indoor temperature is maintained at a second reference indoor temperature or less for the determined duration.

    SEMICONDUCTOR PACKAGE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20200266137A1

    公开(公告)日：2020-08-20

    申请号：US16867004

    申请日：2020-05-05

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae Ean LEE ,  Tae Sung JEONG ,  Young Gwan KO ,  Suk Ho LEE ,  Jung Soo BYUN

    IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48

    Abstract: A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second surface opposing the first surface, an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, a passivation layer on the second surface of the connection member; and an UBM layer partially embedded in the passivation layer, wherein the UBM layer includes an UBM via embedded in the passivation layer and connected to the redistribution layer of the connection member and an UBM pad connected to the UBM via and protruding from a surface of the passivation layer, and a width of a portion of the UBM via in contact with the UBM pad is narrower than a width of a portion of the UBM via in contact with the redistribution layer.

    AIR CONDITIONER AND CONTROL METHOD THEREOF
    4.
    发明申请
    AIR CONDITIONER AND CONTROL METHOD THEREOF 有权
    空调及其控制方法

    公开(公告)号：US20150027144A1

    公开(公告)日：2015-01-29

    申请号：US14300713

    申请日：2014-06-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho LEE ,  II Yong CHO ,  Hyung Mo KOO ,  Chang Yong LEE ,  Joon Hwan LEE ,  Byoung Guk LIM

    IPC: F25D21/00 ,  F24D15/04 ,  F24D19/10 ,  F25D21/02

    CPC classification number: F25D21/006 ,  F24D15/04 ,  F24D19/1087 ,  F24D2200/123 ,  F24F11/30 ,  F24F11/42 ,  F25B47/025 ,  F25B2313/0233 ,  F25B2313/0292 ,  F25B2313/0293 ,  F25B2313/0294 ,  F25B2600/2513 ,  F25B2700/2106 ,  F25D21/02 ,  F25D2600/06 ,  Y02B30/12

    Abstract: An air conditioner, having an outdoor unit and an indoor unit, to perform a heating operation and a defrosting operation, the air conditioner including a detection unit to detect a state of at least one selected between the outdoor unit and the indoor unit and to output the detected value, a controller to determine whether the air conditioner is in a stable state when the defrosting operation is completed and, upon determining that the air conditioner is in the stable state, to control the detected value output from the detection unit to determine entry time of the next defrosting operation, and a storage unit to store a value detected in the stable state. The entry time of the defrosting operation is accurately determined, thereby minimizing the number of times of the defrosting operation during the heating operation.

    Abstract translation: 一种空调机，具有室外机和室内机，进行制热运转和除霜运转，所述空调装置具有检测单元，检测室外机与室内机之间选择的至少一个状态，并输出 所述检测值，控制器，用于当所述除霜运转结束时，判断所述空调机是否处于稳定状态，并且在确定所述空调器处于所述稳定状态时，控制从所述检测单元输出的检测值，以确定进入 下一个除霜操作的时间，以及存储在稳定状态下检测到的值的存储单元。 精确地确定除霜操作的进入时间，从而最小化加热操作期间除霜操作的次数。

    SEMICONDUCTOR PACKAGE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20200219824A1

    公开(公告)日：2020-07-09

    申请号：US16819413

    申请日：2020-03-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho LEE ,  Dong Joon OH ,  Ju Suk KANG

    IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

    Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

    HEAT PUMP AND FLOW PATH SWITCHING APPARATUS
    7.
    发明申请
    HEAT PUMP AND FLOW PATH SWITCHING APPARATUS 审中-公开
    热泵和流路切换装置

    公开(公告)号：US20150027154A1

    公开(公告)日：2015-01-29

    申请号：US14337674

    申请日：2014-07-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Suk Ho LEE ,  II Yong CHO ,  Hyung Mo KOO ,  Min CHANG

    IPC: F25B41/04 ,  F25B30/02

    CPC classification number: F25B41/046 ,  F25B13/00 ,  F25B30/02 ,  F25B2313/007 ,  F25B2313/0231 ,  F25B2313/025 ,  F25B2313/02732 ,  F25B2313/02741

    Abstract: A heat pump performs a simultaneous air-conditioning and heating operation through the addition of a flow path switching apparatus. The heat pump may include a plurality of outdoor units, a plurality of indoor units, and a plurality of flow path switching apparatuses that switch a flow path between an outdoor unit and an indoor unit. A refrigerant flow path may be formed from the outdoor unit to the indoor unit via a high-pressure gas pipe. The flow path switching apparatuses may switch a flow path so that a refrigerant flow path is formed from the indoor unit to the outdoor unit via a low-pressure gas pipe. The heat pump may further include an indoor unit mode controller that is connected to the plurality of outdoor units through a liquid pipe, and which is connected to each of the plurality of flow path switching apparatuses.

    Abstract translation: 热泵通过添加流路切换装置进行同时的空调和制热操作。 热泵可以包括多个室外单元，多个室内单元以及在室外单元和室内单元之间切换流路的多个流路切换装置。 制冷剂流路可以通过高压气体管道从室外单元形成到室内单元。 流路切换装置可以切换流路，从而经由低压气体管从室内单元向室外机形成制冷剂流路。 热泵还可以包括室内单元模式控制器，其通过液体管连接到多个室外单元，并且连接到多个流路切换装置中的每一个。

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