公开(公告)号：US09685498B2

公开(公告)日：2017-06-20

申请号：US15201704

申请日：2016-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Yeol Kang ,  Suk-Jin Chung ,  Youn-Soo Kim ,  Jae-Hyoung Choi ,  Jae-Soon Lim ,  Min-Young Park

IPC: H01L49/02 ,  H01L21/02 ,  H01L21/28 ,  H01L29/51 ,  H01L27/108 ,  H01L29/78

CPC classification number: H01L28/60 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/02189 ,  H01L21/02271 ,  H01L21/0228 ,  H01L21/28194 ,  H01L27/10808 ,  H01L27/10814 ,  H01L27/10855 ,  H01L28/40 ,  H01L29/517 ,  H01L29/78

Abstract: To form a dielectric layer, an organometallic precursor is adsorbed on a substrate loaded into a process chamber. The organometallic precursor includes a central metal and ligands bound to the central metal. An inactive oxidant is provided onto the substrate. The inactive oxidant is reactive with the organometallic precursor. An active oxidant is also provided onto the substrate. The active oxidant has a higher reactivity than that of the inactive oxidant.