公开(公告)号：US20160020366A1

公开(公告)日：2016-01-21

申请号：US14708047

申请日：2015-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-jun HWANG ,  Won-soo JI ,  Do-hyuk KIM

IPC: H01L33/50 ,  H01L21/66 ,  H01L33/58

CPC classification number: H01L22/10 ,  G01J1/0414 ,  G01J1/42 ,  G01J2001/4252 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of manufacturing a light-emitting device package may include steps of preparing a light-emitting device package; holding the light-emitting device package on an inspection table; reflecting, by a reflection member, leaking blue light emitted by the light-emitting device package; capturing, by using a photographing unit, the light emitted by the light-emitting device package and the leaking blue light and generating an optical image; detecting, by a controller, the blue light from the optical image; determining a presence or absence of a defect of the light-emitting device package according to the detected blue light; and displaying the presence or absence of the defect of the light-emitting device package on a display unit.

Abstract translation: 制造发光器件封装的方法可以包括制备发光器件封装的步骤; 将发光装置封装在检查台上; 通过反射构件反射由发光装置封装发出的蓝色光; 通过使用拍摄单元捕获由发光装置包装发出的光和泄漏的蓝光并产生光学图像; 由控制器检测来自光学图像的蓝色光; 根据检测到的蓝光确定发光器件封装的缺陷的存在或不存在; 并且在显示单元上显示发光器件封装的缺陷的存在或不存在。