公开(公告)号：US10894935B2

公开(公告)日：2021-01-19

申请号：US15984050

申请日：2018-05-18

申请人： SAMSUNG ELECTRONICS CO., LTD. ,  Dongwoo Fine-Chem Co., Ltd.

发明人： In-goo Kang ,  Sung-bae Kim ,  Baik-soon Choi ,  Sue-ryeon Kim ,  Young-taek Hong ,  Sang-tae Kim ,  Kyong-ho Lee ,  Hyung-pyo Hong ,  Seong-min Kim

IPC分类号： C11D1/00 ,  C11D3/28 ,  C11D3/20 ,  C11D3/30 ,  C11D7/50 ,  H01L21/683 ,  H01L21/02 ,  C11D7/32 ,  C11D11/00 ,  H01L21/311 ,  H01L21/768 ,  C11D3/00 ,  H01L21/304 ,  C11D3/43 ,  C11D3/24 ,  C09J183/04 ,  B32B43/00 ,  H01L21/67 ,  H01L25/065 ,  H01L23/00 ,  B32B38/10 ,  C11D7/26

摘要： Compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins are provided. The compositions for removing silicone resins, may include a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.