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1.
公开(公告)号:US12170121B2
公开(公告)日:2024-12-17
申请号:US17949000
申请日:2022-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngsan Kang , Donghee Kim , Jungho Jung , Jun-Ho Jo
Abstract: A semiconductor memory device includes: a memory core including memory cells and configured to output core data stored in the memory cells in response to a read request, a command decoder configured to decode at least one command input from an external device, a command log register configured to sequentially store the at least one command in response to a register enable signal and output the at least one command as a command log in response to a command log read signal, and a mode register set configured to generate the register enable signal or the command log read signal in response to a mode register set command transmitted to the command decoder.
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公开(公告)号:US20250150522A1
公开(公告)日:2025-05-08
申请号:US18932148
申请日:2024-10-30
Applicant: SAMSUNG ELECTRONICS CO.,LTD
Inventor: Sungsoo JUN , Donghee Kim , Jaekook Kim , Jinyong Kim , Seunghoon Lee , Sungjun Kim , Youngkyu Kim , Chaeyeol Jung , Minwoo Yoo
IPC: H04M1/02
Abstract: An electronic device including: a transparent member visually exposed to an outside of the electronic device; a support member configured to support the transparent member and including an opening corresponding to the transparent member; an image sensor configured to detect light entering through the transparent member; a body tube configured to accommodate at least one lens; and an intermediate member in contact with a side surface of the body tube that faces the support member, at least part of the intermediate member being provided between the support member and the body tube.
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公开(公告)号:US11747393B2
公开(公告)日:2023-09-05
申请号:US17703535
申请日:2022-03-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Daehyun Kwon , Donghee Kim , Sungoh Huh
IPC: G01R31/28 , H01L23/48 , H01L23/522 , H01L25/065
CPC classification number: G01R31/2884 , H01L23/481 , H01L23/5227 , H01L25/0655
Abstract: An integrated circuit device, a semiconductor substrate, and a test system including the integrated circuit device are disclosed. The integrated circuit device includes a power terminal configured to receive a source voltage, a power via connected to the power terminal and passing through at least one of a number of layers, a number of inductive vias arranged apart from the power via and passing through at least one of the number of layers, a number of wirings connected to ends of at least some of the number of inductive vias and configured to form a coil wound in toroidal form together with the number of inductive vias, around the power via, and a test terminal configured to output an induced voltage in the coil externally of the integrated circuit device, in response to the supply of the source voltage.
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4.
公开(公告)号:US20230335209A1
公开(公告)日:2023-10-19
申请号:US17949000
申请日:2022-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsan Kang , Donghee Kim , Jungho Jung , Jun-Ho Jo
CPC classification number: G11C29/36 , G11C29/12015 , G11C29/1201
Abstract: A semiconductor memory device includes: a memory core including memory cells and configured to output core data stored in the memory cells in response to a read request, a command decoder configured to decode at least one command input from an external device, a command log register configured to sequentially store the at least one command in response to a register enable signal and output the at least one command as a command log in response to a command log read signal, and a mode register set configured to generate the register enable signal or the command log read signal in response to a mode register set command transmitted to the command decoder.
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公开(公告)号:US10564738B2
公开(公告)日:2020-02-18
申请号:US15960668
申请日:2018-04-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chang-Ok Lim , Donghee Kim , Youngmoon Park , Namhyoung Cho , Hyun-Seok Chang
IPC: G06F1/16 , G06F3/0362 , G04G21/00 , G04G17/04 , G01D5/14
Abstract: An electronic device according to one embodiment may include: a housing having a first side facing a first direction, a second side facing a second direction opposite to the first direction, and a side surrounding at least a portion of a space between the first side and the second side; a display disposed on the first side of the housing; a detachable input device disposed to surround the display on the first side; and a coupling structure that detachably couples the detachable input device to the housing. Other embodiments may be possible.
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