公开(公告)号：US20240196540A1

公开(公告)日：2024-06-13

申请号：US18554556

申请日：2022-04-11

Applicant: SAMTEC, INC.

Inventor： Christopher David BOHN ,  Mark CRAIN ,  Justin ROEHM ,  Thomas Jacob HAMMANN ,  Nathan ROBERTSON ,  Jeremy BROWN ,  Christopher PELKEY ,  Adam OWENS ,  Russell PAYTON ,  Russell FRANK

IPC: H05K3/00 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K3/0094 ,  H01L21/486 ,  H01L23/49827 ,  H05K1/115 ,  H05K3/426 ,  H05K2203/128

Abstract: A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.