公开(公告)号：US20100043839A1

公开(公告)日：2010-02-25

申请号：US12607313

申请日：2009-10-28

申请人： SATOMI HAMADA ,  MICHIHISA KONO ,  ICHIRO KATAKABE ,  SHOHEI SHIMA

发明人： SATOMI HAMADA ,  MICHIHISA KONO ,  ICHIRO KATAKABE ,  SHOHEI SHIMA

IPC分类号： B08B5/00 ,  F26B21/08

CPC分类号： H01L21/02087 ,  C23F1/18 ,  H01L21/02074 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/67028 ,  H01L21/67051

摘要： The present invention provides a substrate processing apparatus having a drying mechanism for removing water from a surface of a substrate which has been cleaned by a wet cleaning process, and a substrate processing apparatus and a substrate processing method which are capable of efficiently removing an unnecessary thin film deposited on or adhering to a bevel or edge portion of a substrate. The substrate processing apparatus of this invention has a substrate holder for holding a substrate, and a dry gas supply section for turning an atmosphere, to which at least a portion of a surface of the substrate held by the substrate holder is exposed, into a humidity-controlled dry gas atmosphere.

摘要翻译： 本发明提供了一种具有干燥机构的基板处理装置，该干燥机构用于通过湿式清洗工序清洗的基板表面除去水分，以及能够有效地除去不需要的薄膜的基板处理装置和基板处理方法 膜沉积在或粘附到基底的斜面或边缘部分上。 本发明的基板处理装置具有用于保持基板的基板保持件和用于转动由基板保持件保持的基板的至少一部分表面露出的气氛的干燥气体供给部， 控制的干气氛。