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1.发明公开公开(公告)号：US20240217813A1
公开(公告)日：2024-07-04
申请号：US18397631
申请日：2023-12-27
发明人： Yasutoshi HIDESHIMA , Shunsuke UCHIZONO , Setsuya IWASHITA , Fumiya MAEDA , Koichi OZAKI , Tadao FUKUTA
CPC分类号： C01B3/08 , C01B5/00 , C01B33/06 , C01B33/113 , C01D1/02 , C01G3/02 , C01P2004/61
摘要： A thixotropically molded product that generates hydrogen by contact with an aqueous solution includes: a matrix portion containing Mg as a main component; and a first particle portion dispersed in the matrix portion and containing, as a main component, any one of Fe, Ni, Co, Cu, and a compound containing at least one of the elements. An average particle diameter of the first particle portion in a cross section is 30.0 μm or less, and an area fraction of the first particle portion in the cross section is 0.5% or more and 20.0% or less.
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2.发明公开公开(公告)号：US20240218484A1
公开(公告)日：2024-07-04
申请号：US18396876
申请日：2023-12-27
发明人： Setsuya IWASHITA , Tetsuhiko TAKEUCHI , Yasutoshi HIDESHIMA , Fumiya MAEDA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
CPC分类号： C22C1/1089 , C22C32/0047 , C23C24/103
摘要： A thixotropic molding material includes: a metal body containing Mg as a main component; AlN particles adhering to a surface of the metal body and containing AlN as a main component; and silica particles interposed between the metal body and the AlN particles, having an average particle diameter smaller than an average particle diameter of the AlN particles, and containing a silicon oxide as a main component. A mass fraction of the AlN particles in a total mass of the metal body and the AlN particles is 3.0% or more and 30.0% or less.
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3.发明申请公开(公告)号：US20220314315A1
公开(公告)日：2022-10-06
申请号：US17656600
申请日：2022-03-25
发明人： Shunsuke UCHIZONO , Setsuya IWASHITA , Yasutoshi HIDESHIMA , Fumiya MAEDA , Koichi OZAKI , Tadao FUKUTA
摘要： A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
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4.发明公开公开(公告)号：US20240218522A1
公开(公告)日：2024-07-04
申请号：US18396981
申请日：2023-12-27
发明人： Fumiya MAEDA , Yasutoshi HIDESHIMA , Setsuya IWASHITA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
CPC分类号： C23C24/10 , C22C23/02 , C22C26/00 , C22C2026/003 , C22C2026/008
摘要： A thixotropically molded product includes: a matrix portion containing Mg as a main component; and a first particle portion dispersed in the matrix portion and containing c-BN or w-BN as a main component. An average particle diameter of the first particle portion in a cross section is 10.0 μm or less, and an area fraction of the first particle portion in the cross section is 2.0% or more and 20.0% or less.
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公开(公告)号：US20240218230A1
公开(公告)日：2024-07-04
申请号：US18397694
申请日：2023-12-27
发明人： Yasutoshi HIDESHIMA , Setsuya IWASHITA , Fumiya MAEDA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
摘要： A thixotropically molded product includes: a matrix portion containing Mg as a main component; and carbon fibers dispersed in the matrix portion. An area fraction of the carbon fibers in a cross section is 1.0% or more and 30.0% or less. An average fiber length of the carbon fibers may be 15 μm or more and 150 μm or less.
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6.发明公开公开(公告)号：US20240209312A1
公开(公告)日：2024-06-27
申请号：US18393794
申请日：2023-12-22
发明人： Yasutoshi HIDESHIMA , Fumiya MAEDA
摘要： A method includes: supplying a gas 600 containing carbon dioxide to a liquid surface 201 of a liquid medium 200 inoculated with hydrogen-oxidizing bacteria that are growable using the carbon dioxide as a carbon source; and supplying hydrogen 700 to the hydrogen-oxidizing bacteria, the hydrogen being generated by bringing the liquid medium 200 into contact with a metal body 300 and causing a corrosion reaction in the metal body 300.
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7.发明申请公开(公告)号：US20220316070A1
公开(公告)日：2022-10-06
申请号：US17656527
申请日：2022-03-25
发明人： Fumiya MAEDA , Yasutoshi HIDESHIMA , Setsuya IWASHITA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
摘要： A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 μm or more and 100 μm or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
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8.发明申请公开(公告)号：US20220314314A1
公开(公告)日：2022-10-06
申请号：US17656544
申请日：2022-03-25
发明人： Yasutoshi HIDESHIMA , Setsuya IWASHITA , Fumiya MAEDA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
摘要： A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
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9.发明公开公开(公告)号：US20240218521A1
公开(公告)日：2024-07-04
申请号：US18396908
申请日：2023-12-27
发明人： Setsuya IWASHITA , Tetsuhiko TAKEUCHI , Yasutoshi HIDESHIMA , Fumiya MAEDA , Shunsuke UCHIZONO , Koichi OZAKI , Tadao FUKUTA
摘要： A thixotropically molded product includes: a matrix portion containing Mg as a main component; and a particle portion dispersed in the matrix portion and containing α-Al2O3 as a main component. In a cross section, a total area fraction of the particle portion in a range of 500 μm square around a point at a depth of 1 mm from a surface is 0.5% or more and 30.0% or less.
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10.发明公开公开(公告)号：US20240216988A1
公开(公告)日：2024-07-04
申请号：US18397832
申请日：2023-12-27
发明人： Shunsuke UCHIZONO , Yasutoshi HIDESHIMA , Setsuya IWASHITA , Fumiya MAEDA , Koichi OZAKI , Tadao FUKUTA
CPC分类号： B22D21/007 , C22C1/1068 , C22C23/02
摘要： A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a second particle portion dispersed in the matrix portion and containing Mg2Si as a main component; and a third particle portion dispersed in the matrix portion and containing MgO as a main component. An area fraction of the first particle portion in a cross section is 0.68 or more and 19.6% or less.
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