摘要:
A method of manufacturing a thermal head, including: forming a concave being, which is open on one surface of a support-substrate made of an alumina material; forming an intermediate-layer made of a glass paste by printing the glass paste made of a first-glass-material on the one surface of the support-substrate and baking the glass paste; bonding an upper-substrate to the one surface of the support-substrate by arranging the upper-substrate on the intermediate-layer formed on the one surface of the support-substrate in a laminated state and heating the upper-substrate at a temperature of an annealing point thereof or higher and a softening point thereof or lower, the upper-substrate being made of a second-glass-material having a softening point lower than a softening point of the first-glass-material; and forming a heat generating resistor on a surface of the upper-substrate bonded to the support-substrate at a position opposed to the concave portion.
摘要:
The thermal head includes a support substrate, a glaze layer, heating resistors provided on the surface of the glaze layer, and a pair of electrode portions formed on the surface of the heating resistor. Each of the pair of electrode portions includes a thick electrode portion and a thin electrode portion. The thick electrode portion includes a flat surface having a thickness h1 and an inclined surface which is provided from the flat surface toward the center C of the surface of the heating resistor. The thin electrode portion has a thickness h2 smaller than the thickness h1, and is formed so as to cover the thick electrode portion.
摘要:
A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a heat-insulating concave portion; thinning the upper substrate bonded onto the support substrate in the bonding step; measuring a thickness of the upper substrate thinned in the thinning step; forming an identifying resistor having a resistance value varied in accordance with the thickness of the upper substrate measured in the measurement step, the identifying resistor including one end grounded; and forming a heating resistor on a surface of the upper substrate thinned in the thinning step at a position opposed to the heat-insulating concave portion.
摘要:
A thermal head comprises: a support substrate; an upper substrate arranged on the support substrate on one surface side thereof in a laminated state; an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; and a heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion, wherein the upper substrate has a melting point lower than a melting point of the intermediate layer.
摘要:
A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.
摘要:
A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R0×(1+(D1+D0)/(D0+K)) where Rh represents the target resistance value; R0, a design resistance value; D1, the thickness of the upper substrate; D0, a design thickness of the upper substrate; and K, a heating efficiency coefficient.