THERMAL HEAD MANUFACTURING METHOD, THERMAL HEAD, AND PRINTER
    2.
    发明申请
    THERMAL HEAD MANUFACTURING METHOD, THERMAL HEAD, AND PRINTER 有权
    热头制造方法,热头和打印机

    公开(公告)号:US20130335499A1

    公开(公告)日:2013-12-19

    申请号:US13919196

    申请日:2013-06-17

    IPC分类号: B41J2/335

    摘要: A method of manufacturing a thermal head, including: forming a concave being, which is open on one surface of a support-substrate made of an alumina material; forming an intermediate-layer made of a glass paste by printing the glass paste made of a first-glass-material on the one surface of the support-substrate and baking the glass paste; bonding an upper-substrate to the one surface of the support-substrate by arranging the upper-substrate on the intermediate-layer formed on the one surface of the support-substrate in a laminated state and heating the upper-substrate at a temperature of an annealing point thereof or higher and a softening point thereof or lower, the upper-substrate being made of a second-glass-material having a softening point lower than a softening point of the first-glass-material; and forming a heat generating resistor on a surface of the upper-substrate bonded to the support-substrate at a position opposed to the concave portion.

    摘要翻译: 一种制造热敏头的方法,包括:在由氧化铝材料制成的支撑衬底的一个表面上形成凹形; 通过在支撑基板的一个表面上印刷由第一玻璃材料制成的玻璃糊料并烘烤玻璃浆料,形成由玻璃浆料制成的中间层; 通过将上基板层叠在形成在支撑基板的一个表面上的中间层上,并在层叠状态下将上基板粘合到支撑基板的一个表面,并在 退火点以上且软化点以下,上基板由软化点低于第一玻璃材料的软化点的第二玻璃材料构成; 以及在与所述凹部相对的位置处,在与所述支撑基板接合的所述上基板的表面上形成发热电阻体。

    THERMAL HEAD AND METHOD OF MANUFACTURING THE SAME, AND THERMAL PRINTER
    3.
    发明申请
    THERMAL HEAD AND METHOD OF MANUFACTURING THE SAME, AND THERMAL PRINTER 审中-公开
    热头及其制造方法和热打印机

    公开(公告)号:US20130088557A1

    公开(公告)日:2013-04-11

    申请号:US13644732

    申请日:2012-10-04

    IPC分类号: B41J2/335 H05K13/00

    摘要: The thermal head includes a support substrate, a glaze layer, heating resistors provided on the surface of the glaze layer, and a pair of electrode portions formed on the surface of the heating resistor. Each of the pair of electrode portions includes a thick electrode portion and a thin electrode portion. The thick electrode portion includes a flat surface having a thickness h1 and an inclined surface which is provided from the flat surface toward the center C of the surface of the heating resistor. The thin electrode portion has a thickness h2 smaller than the thickness h1, and is formed so as to cover the thick electrode portion.

    摘要翻译: 热敏头包括支撑衬底,釉层,设置在釉层表面上的加热电阻器和形成在加热电阻器表面上的一对电极部分。 一对电极部分中的每一个包括厚电极部分和薄电极部分。 厚电极部分包括具有厚度h1的平坦表面和从平坦表面朝向加热电阻器表面的中心C提供的倾斜表面。 薄电极部具有小于厚度h1的厚度h2,形成为覆盖厚电极部。

    METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER AND METHOD OF DRIVING THE SAME
    4.
    发明申请
    METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER AND METHOD OF DRIVING THE SAME 审中-公开
    制造热头的方法和热打印机及其驱动方法

    公开(公告)号:US20130141508A1

    公开(公告)日:2013-06-06

    申请号:US13680937

    申请日:2012-11-19

    IPC分类号: B41J2/335

    摘要: A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a heat-insulating concave portion; thinning the upper substrate bonded onto the support substrate in the bonding step; measuring a thickness of the upper substrate thinned in the thinning step; forming an identifying resistor having a resistance value varied in accordance with the thickness of the upper substrate measured in the measurement step, the identifying resistor including one end grounded; and forming a heating resistor on a surface of the upper substrate thinned in the thinning step at a position opposed to the heat-insulating concave portion.

    摘要翻译: 一种制造热敏头的方法,包括以下步骤:将层叠状态下的具有平坦形状的支撑基板和上基板结合在一起,所述支撑基板和所述上基板具有相对的表面,其中至少一个 包括绝热凹部; 在接合步骤中,使粘合到支撑基板上的上基板变薄; 测量在稀疏步骤中变薄的上基板的厚度; 形成具有根据在所述测量步骤中测量的所述上基板的厚度而变化的电阻值的识别电阻器,所述识别电阻器包括一端接地; 以及在与所述绝热凹部相对的位置处在所述变薄步骤中变薄的所述上基板的表面上形成发热电阻体。

    THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD
    5.
    发明申请
    THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD 有权
    热头,打印机和制造热头的方法

    公开(公告)号:US20130335500A1

    公开(公告)日:2013-12-19

    申请号:US13898823

    申请日:2013-05-21

    IPC分类号: B41J2/335 H01C17/00

    摘要: A thermal head comprises: a support substrate; an upper substrate arranged on the support substrate on one surface side thereof in a laminated state; an intermediate layer which is arranged between the upper substrate and the support substrate to bond the upper substrate and the support substrate to each other, and which has one of a through hole and a concave portion to form a cavity portion between the upper substrate and the support substrate; and a heat generating resistor formed on a surface of the upper substrate on a side opposite to the support substrate at a position opposed to the cavity portion, wherein the upper substrate has a melting point lower than a melting point of the intermediate layer.

    摘要翻译: 热敏头包括:支撑衬底; 层叠状态的一个表面侧配置在所述支撑基板上的上基板; 布置在上基板和支撑基板之间的中间层,以将上基板和支撑基板彼此接合,并且具有通孔和凹部中的一个,以在上基板和支撑基板之间形成空腔部分 支撑基板; 以及发热电阻器,其在与所述空腔部相对的位置的与所述支撑基板相反的一侧的所述上基板的表面上形成,其中所述上基板的熔点低于所述中间层的熔点。

    THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD
    6.
    发明申请
    THERMAL HEAD, PRINTER, AND METHOD OF MANUFACTURING THERMAL HEAD 有权
    热头,打印机和制造热头的方法

    公开(公告)号:US20130169729A1

    公开(公告)日:2013-07-04

    申请号:US13722092

    申请日:2012-12-20

    IPC分类号: B41J2/335

    摘要: A thermal head including: a laminated substrate including a support substrate and an upper substrate at least one of which has a recess formed in a surface thereof; a heat generating resistor formed on a surface of the upper substrate in the laminated substrate at a position opposed to the recess; and a pair of electrode portions connected to each of both ends of a heat generating resistor, wherein the laminated substrate further includes: an intermediate metal layer sandwiched between the support substrate and the upper substrate and bonded thereto in a laminated state; and a surrounding metal layer formed of a metal material, the surrounding metal layer provided in contact with the intermediate metal layer and formed from a surface of the support substrate extending in a thickness direction thereof to a surface thereof opposite to a portion bonded to the upper substrate.

    摘要翻译: 一种热敏头,包括:层压基板,包括支撑基板和上基板,其中至少一个在其表面上形成有凹部; 发热电阻器,其在与所述凹部相对的位置处形成在所述层叠基板的所述上基板的表面上; 以及与发热电阻体的两端连接的一对电极部,其特征在于,所述层叠基板还包括夹在所述支撑基板和所述上基板之间的层叠状态的中间金属层, 以及由金属材料形成的周围金属层,所述周围金属层设置成与所述中间金属层接触并且由从所述支撑基板的厚度方向延伸的表面形成为与所述中间金属层的与所述中间金属层接合的部分相对的表面 基质。

    METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER
    7.
    发明申请
    METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER 有权
    制造热头和热打印机的方法

    公开(公告)号:US20130141507A1

    公开(公告)日:2013-06-06

    申请号:US13680914

    申请日:2012-11-19

    IPC分类号: H01C17/00 B41J2/335

    摘要: A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R0×(1+(D1+D0)/(D0+K)) where Rh represents the target resistance value; R0, a design resistance value; D1, the thickness of the upper substrate; D0, a design thickness of the upper substrate; and K, a heating efficiency coefficient.

    摘要翻译: 一种制造热敏头的方法,包括以下步骤:将层叠状态下的具有平坦形状的支撑基板和上基板结合在一起,所述支撑基板和所述上基板具有相对的表面,其中至少一个 包括凹部; 使粘合到支撑衬底上的上衬底变薄; 测量所述变薄的上基板的厚度的测量步骤; 基于所测量的上基板的厚度,从以下表达式确定加热电阻器的目标电阻值; 在与凹部相对的位置处形成具有目标电阻值的加热电阻器,Rh = R0×(1+(D1 + D0)/(D0 + K)),其中Rh表示目标电阻值; R0,设计电阻值; D1,上基板的厚度; D0,上基板的设计厚度; 和K,加热效率系数。