公开(公告)号：US20230348767A1

公开(公告)日：2023-11-02

申请号：US18025730

申请日：2021-09-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Izumi DAIDO ,  Toshio TAKAHASHI ,  Tokushige SHICHIRI ,  Satoshi HAYASHI ,  Fumika HOSHINO

IPC: C09J11/04 ,  C09J179/08 ,  C09J11/08

CPC classification number: C09J179/08 ,  C09J11/04 ,  C09J11/08 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/312 ,  C09J2301/408 ,  C09J2301/502

Abstract: The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.

公开(公告)号：US20230312923A1

公开(公告)日：2023-10-05

申请号：US18025232

申请日：2021-09-22

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Toshio TAKAHASHI ,  Tokushige SHICHIRI ,  Satoshi HAYASHI ,  Izumi DAIDO ,  Fumika HOSHINO

IPC: C08L79/08 ,  C08K5/3415 ,  C09J179/08

CPC classification number: C08L79/08 ,  C08K5/3415 ,  C09J179/08

Abstract: The present invention aims to provide a curable resin composition that can reduce the occurrence of voids and partial detachment between the composition and a support even in high-temperature processing at 300° C. or higher with an adherend fixed to the support with the composition, and is easily separable after the high-temperature processing. The present invention also aims to provide a temporary fixing material including an adhesive layer containing the curable resin composition and a method of producing an electronic component using the temporary fixing material. Provided is a curable resin composition containing: a maleimide group-containing reactive compound (1); and a resin (2) having an imide skeleton in a backbone repeating unit.