公开(公告)号：US20230215693A1

公开(公告)日：2023-07-06

申请号：US18147480

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Chan Yong AN ,  Ja Myung Gu ,  Sang Moon Yoo ,  Tae Hoon Jo

IPC: H01J37/32

CPC classification number: H01J37/32155 ,  H01J37/32642 ,  H01J37/32091 ,  H01J37/32522 ,  H01J2237/334

Abstract: The inventive concept provides a substrate processing apparatus. The substrate processing apparatus may include a chamber having an interior space, a support unit that supports a substrate in the interior space, a ring unit disposed on an edge region of the support unit when viewed from above, an impedance control unit electrically connected to the ring unit to control a flow or density of plasma in an edge region of the substrate and a filter unit disposed between the ring unit and the impedance control unit.