公开(公告)号：US20250087504A1

公开(公告)日：2025-03-13

申请号：US18824861

申请日：2024-09-04

Applicant: SEMES CO., LTD.

Inventor： Changhoon OK ,  Jae Gyeong LEE ,  Jinsoo KIM

IPC: H01L21/67 ,  H01L21/48 ,  H01L21/66

Abstract: Provided is a semiconductor package cutting system including a loading device storing at least one strip or at least one magazine containing the strip, a cutting device mounted behind the loading device to partial-cut at least a portion of the strip supplied from the loading device, an inspection device mounted behind the cutting device to inspect the strip cut by the cutting device, and an unloading device mounted behind the inspection device to unload the inspected strip.

公开(公告)号：US20250083359A1

公开(公告)日：2025-03-13

申请号：US18824834

申请日：2024-09-04

Applicant: SEMES CO., LTD.

Inventor： Changhoon OK ,  Jae Gyeong LEE ,  Jinsoo KIM

IPC: B28D5/04 ,  B28D5/00

Abstract: Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted behind the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted behind the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the first or second strip thereon and moving the first strip along a first direction.

公开(公告)号：US20240316709A1

公开(公告)日：2024-09-26

申请号：US18584446

申请日：2024-02-22

Applicant: SEMES CO., LTD.

Inventor： Changhoon OK ,  Yonghyun LEE

IPC: B23Q3/155 ,  B23Q3/06 ,  H01L21/67

CPC classification number: B23Q3/1554 ,  B23Q3/069 ,  B23Q3/15503 ,  B23Q3/15553 ,  H01L21/67121 ,  H01L21/67271

Abstract: Provided is a tool changing apparatus and method capable of easily and safely changing various tools usable for a table device or a pickup device of an equipment depending on materials such as semiconductor chips or semiconductor packages, the tool changing apparatus including a target tool detachably mountable on an equipment depending on a type or size of semiconductor chips or semiconductor packages, and a coupling device mounted between the equipment and the target tool to detachably fix the target tool to the equipment, wherein the coupling device includes a stud mounted on the target tool or the equipment, and a clamping module mounted in the equipment or the target tool to clamp the stud.

公开(公告)号：US20250087503A1

公开(公告)日：2025-03-13

申请号：US18824705

申请日：2024-09-04

Applicant: SEMES CO., LTD.

Inventor： Changhoon OK ,  Jae Gyeong LEE ,  Jinsoo KIM

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/78

Abstract: Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted at a side of the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted at a side of the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the second strip thereon and moving the second strip along a first direction.