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公开(公告)号：US11940734B2
公开(公告)日：2024-03-26
申请号：US17726343
申请日：2022-04-21
申请人： SEMES CO., LTD.
发明人： Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
摘要： The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
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公开(公告)号：US20230341779A1
公开(公告)日：2023-10-26
申请号：US17726343
申请日：2022-04-21
申请人： SEMES CO., LTD.
发明人： Ki Hoon Choi , Eung Su Kim , Pil Kyun Heo , Jin Yeong Sung , Hae-Won Choi , Anton Koriakin , Joon Ho Won
摘要： The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a supply line having a first open/close valve installed thereon and configured to supply a treating fluid to the treating space; a heater installed on the supply line and configured to heat the treating fluid; an exhaust line having a second open/close valve installed thereon and configured to exhaust the treating space; and, a controller configured to control the first open/close value and the second open/close valve such that the treating fluid heated is supplied to and exhausted from the treating space before a treating process is performed on a substrate in the treating space.
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公开(公告)号：US11448694B2
公开(公告)日：2022-09-20
申请号：US16915179
申请日：2020-06-29
申请人： SEMES CO., LTD.
发明人： Eung Su Kim , Chang Taek Lee
IPC分类号： G01R31/28
摘要： A semiconductor package test apparatus includes an interface board having connection terminals for electrically connecting a semiconductor package to a tester, a push block for pressing the semiconductor package toward the interface board to bring external terminals of the semiconductor package into contact with the connection terminals of the interface board, a temperature adjustment unit connected with the push block to heat or cool the semiconductor package to a test temperature through the push block, and a heat transfer member for thermally connecting the push block and the interface board.
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