APPARATUS AND METHOD FOR TREATING SUBSTRATE
    1.
    发明申请
    APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开
    用于处理基板的装置和方法

    公开(公告)号:US20160351385A1

    公开(公告)日:2016-12-01

    申请号:US15165020

    申请日:2016-05-26

    Abstract: An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

    Abstract translation: 一种用于处理基板的设备包括:注射构件,其具有构造成将第一化学品供应到安装在支撑单元上的基板的第一喷嘴;以及第二喷嘴,其构造成供应与第一化学品不同的第二化学品, 到安装在支撑单元上的基板,以及控制器,被配置为在供应第二化学品之前提供第一化学品并且控制第一化学品,其根据安装在支撑单元上的基板上的薄膜类型而变化 ,供应。

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