SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20220008964A1

    公开(公告)日:2022-01-13

    申请号:US17369892

    申请日:2021-07-07

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber that provides a treatment space, in which a substrate is treated, in an interior thereof, a fluid supply unit that supplies a fluid into the process chamber, and an exhaust units including an exhaust line, through which the fluid in the process chamber is exhausted, the fluid supply unit includes a supply tank, in which the fluid is stored, a supply line connecting the supply tank and the process chamber, a branch line branched from the supply line at a first point of the supply line, and a controller that controls the fluid supply unit, and the controller controls the fluid supply unit such that the fluid is drained from the supply line through the branch line shortly before the fluid is supplied into the process chamber.

    APPARATUS FOR TREATING SUBSTRATE
    2.
    发明申请

    公开(公告)号:US20220205718A1

    公开(公告)日:2022-06-30

    申请号:US17564632

    申请日:2021-12-29

    Abstract: An apparatus for treating the substrate includes a process chamber having a first body and a second body which are combined with each other to have a treating space in which a substrate is treated, and a friction prevention member placed on a contact surface between the first body and the second body. The friction prevention member may have a groove formed at a surface corresponding to the contact surface. An adhesive for adhering the friction prevention member to the first body or adhering the friction prevention member to the second body may be provided in the groove. The groove may form an open-end pattern in which a first end of the open-end pattern is adjacent to a second end of the open-end pattern.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20190333759A1

    公开(公告)日:2019-10-31

    申请号:US16396906

    申请日:2019-04-29

    Abstract: The apparatus includes a chamber having a first body and a second body that are combined with each other to form a processing space inside, an actuator that moves a relative position between the first body and the second body to enable a position change between a closed position in which the processing space is sealed from the outside and an open position in which the processing space is open to the outside, the actuator to sequentially perform a high-speed closing step of moving the first body or the second body at a first speed and a low-speed closing step of moving the first body or the second body at a second speed lower than the first speed, at the time of the position change from the open position to the closed position.

    APPARATUS FOR PROCESSING SUBSTRATE

    公开(公告)号:US20220084814A1

    公开(公告)日:2022-03-17

    申请号:US17531741

    申请日:2021-11-20

    Abstract: The apparatus includes a chamber having a first body and a second body that are combined with each other to form a processing space inside, an actuator that moves a relative position between the first body and the second body to enable a position change between a closed position in which the processing space is sealed from the outside and an open position in which the processing space is open to the outside, the actuator to sequentially perform a high-speed closing step of moving the first body or the second body at a first speed and a low-speed closing step of moving the first body or the second body at a second speed lower than the first speed, at the time of the position change from the open position to the closed position.

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