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公开(公告)号：US11367634B2
公开(公告)日：2022-06-21
申请号：US16557790
申请日：2019-08-30
Applicant: SEMES CO., LTD.
Inventor： Ohyeol Kwon , Jihyun Lee , Young Ho Choo
IPC: H01L21/67 , H01L21/687 , H01L21/68
Abstract: The inventive concept relates to a substrate treating apparatus and method for removing various types of treating liquid or cleaning solution films on an edge region of a substrate without damage to a treated surface even though the substrate is rotated in an eccentric state.
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公开(公告)号：US12236574B2
公开(公告)日：2025-02-25
申请号：US17461610
申请日：2021-08-30
Applicant: SEMES CO., LTD.
Inventor： Ohyeol Kwon , Soo Yeon Shin , Jihyun Lee , Chang Yul Cho
Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.
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公开(公告)号：US20200167946A1
公开(公告)日：2020-05-28
申请号：US16685345
申请日：2019-11-15
Applicant: Semes Co., Ltd.
Inventor： Ohyeol KWON , Soo Young Park , Jihyun Lee , Young Ho Choo
IPC: G06T7/64 , G06T7/13 , G06T7/11 , G06T7/00 , H01L21/687
Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.
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公开(公告)号：US11158079B2
公开(公告)日：2021-10-26
申请号：US16685345
申请日：2019-11-15
Applicant: Semes Co., Ltd
Inventor： Ohyeol Kwon , Soo Young Park , Jihyun Lee , Young Ho Choo
Abstract: Disclosed are a substrate treating apparatus, an eccentricity inspection apparatus, an eccentricity inspection method, and a recording medium for measuring the amount of eccentricity of a spin chuck. The substrate treating apparatus includes a process chamber, a support unit that supports a substrate and rotates the substrate about a support shaft of a spin chuck, and an eccentricity inspection device that inspects eccentricity of the support shaft. The eccentricity inspection device includes an image acquisition unit that obtains an image of the substrate supported on the support unit and an eccentricity measurement unit that obtains edge data of the substrate from the image of the substrate and measures an amount of eccentricity of the support shaft, based on the edge data.
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