TREATMENT LIQUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME AND METHOD FOR PROCESSING TREATMENT LIQUID

    公开(公告)号:US20250099999A1

    公开(公告)日:2025-03-27

    申请号:US18675465

    申请日:2024-05-28

    Abstract: A treatment liquid supply apparatus includes a discharge line through which treatment liquid is discharged from a substrate processing apparatus; a first tank storing recovered treatment liquid, recovered through the discharge line; a treatment liquid supply unit supplying new treatment liquid to the discharge line through a first transfer line; a first heating unit disposed between the treatment liquid supply unit and the discharge line and controlling a temperature of the new treatment liquid passing through the first transfer line; and a second tank resupplying the recovered treatment liquid supplied from the first tank through a second transfer line to the substrate processing apparatus through a supply line.

    APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

    公开(公告)号:US20240153792A1

    公开(公告)日:2024-05-09

    申请号:US18387713

    申请日:2023-11-07

    CPC classification number: H01L21/6708 H01L21/30604

    Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution. The apparatus includes a substrate rotating device configured to rotate a seated substrate in a spinning manner, a chemical solution supply device configured to supply a chemical solution to the substrate, a chemical solution discharge line configured to discharge the chemical solution having undergone a process to an outside, a chemical solution circulation line configured to circulate the chemical solution having undergone the process to the chemical solution supply device, and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of process by-products to the outside through the chemical solution discharge line and to circulate a chemical solution containing a second amount of process by-products through the chemical solution circulation line, wherein the first amount of process by-products is larger than the second amount of process by-products.

Patent Agency Ranking