公开(公告)号：US20250096018A1

公开(公告)日：2025-03-20

申请号：US18811189

申请日：2024-08-21

Applicant: SEMES CO., LTD.

Inventor： Changhwa JEONG ,  Jungsoo LEE ,  Youngkyu OH ,  Chungoh HONG ,  Jiyun AHN

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: A substrate processing apparatus includes an loading stage configured to receive first and second substrates and including a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the first substrate alignment portion being spaced apart from the first substrate alignment portion; an coating stage configured to sequentially receive the first substrate and the second substrate from the loading stage and including a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading stage configured to sequentially unload the first substrate and the second substrate from the coating stage.

公开(公告)号：US20230364912A1

公开(公告)日：2023-11-16

申请号：US18305801

申请日：2023-04-24

Applicant: SEMES CO.,LTD.

Inventor： Won-Yong JIN ,  Hosang LEE ,  Jiyun AHN ,  Suk-Won JANG ,  Jae-Duck LEE

IPC: B41J2/165 ,  B41J2/175

CPC classification number: B41J2/16532 ,  B41J2/175

Abstract: A maintenance assembly for an inkjet head may include a housing having an upper face facing a nozzle face on which nozzles for discharging a chemical liquid on a substrate are arranged, and a fluid supplying part for providing a humidity control fluid onto the nozzles and the nozzle face such that a humidity of the nozzles and a humidity of the nozzle face are adjusted to a set humidity if the humidity of the nozzles and the humidity of the nozzle face are different from the set humidity.