公开(公告)号：US20250096018A1

公开(公告)日：2025-03-20

申请号：US18811189

申请日：2024-08-21

Applicant: SEMES CO., LTD.

Inventor： Changhwa JEONG ,  Jungsoo LEE ,  Youngkyu OH ,  Chungoh HONG ,  Jiyun AHN

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

Abstract: A substrate processing apparatus includes an loading stage configured to receive first and second substrates and including a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the first substrate alignment portion being spaced apart from the first substrate alignment portion; an coating stage configured to sequentially receive the first substrate and the second substrate from the loading stage and including a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading stage configured to sequentially unload the first substrate and the second substrate from the coating stage.

公开(公告)号：US20230201891A1

公开(公告)日：2023-06-29

申请号：US18063387

申请日：2022-12-08

Applicant: Semes Co., Ltd.

Inventor： Youngkyu OH

IPC: B08B9/032

CPC classification number: B08B9/0325 ,  B08B9/0323 ,  B08B2209/032

Abstract: An apparatus for processing a substrate may include a vacuum suction part including vacuum holes configured to apply a vacuum pressure to a rear face of a substrate while a predetermined process is performed on the substrate, and a cleaning part configured to clean the vacuum holes in a cleaning process of cleaning the vacuum holes. The cleaning part may include a cleaning solution supply part configured to provide a cleaning solution into the vacuum holes, and a cleaning solution discharge part configured to discharge the cleaning solution from the vacuum holes.