公开(公告)号：US20220392784A1

公开(公告)日：2022-12-08

申请号：US17829678

申请日：2022-06-01

Applicant: SEMES CO., LTD.

Inventor： Ji Ho KIM ,  Jong Han KIM ,  Ju Dong LEE ,  Ju Hwan LEE ,  Hyeon Jun LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: The inventive concept provides a liquid treating apparatus. The liquid treating apparatus includes a spin chuck configured to support and rotate a substrate; and a liquid supply unit configured to supply a liquid to the substrate, and wherein the liquid supply unit includes: a first nozzle connected to a first flow path pipe and configured to discharge a first liquid to the substrate; a first valve assembly including a first cut-off valve for cutting-off a flow of the first liquid within the first flow path pipe and a first suck-back valve for sucking-back the first liquid, and installed at the first flow pipe; a second nozzle connected to a second flow path pipe and configured to discharge a second liquid to the substrate; a second valve assembly including a second cut-off valve for cutting-off a flow of the second liquid within the second flow path pipe and a second suck-back valve for sucking-back the second liquid, and installed at the second flow pipe path; a first flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the first suck-back valve; and a second flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the second suck-back valve, and wherein a first speed of a suck-back speed provided by the first valve assembly is slower than a second suck-back speed provided by the second valve assembly, and a surface tension of the first liquid is lower than a surface tension of the second liquid.

公开(公告)号：US20240226920A9

公开(公告)日：2024-07-11

申请号：US18465524

申请日：2023-09-12

Applicant: SEMES CO., LTD. ,  Samsung Electronics Co., Ltd.

Inventor： Jong Han KIM ,  Jin Uk SONG ,  Rae Taek OH ,  Ji Ho KIM ,  Ho Kyung KANG ,  Kwang Sung SON

IPC: B05B1/02

CPC classification number: B05B1/02

Abstract: According to at least one example embodiment, a substrate treating apparatus includes a substrate support structure including a spin head, the substrate support structure configured to support a substrate, and rotate the substrate, at least one treating liquid recovery container configured to recover at least one substrate treating liquid, and a discharging device including a first nozzle and a second nozzle, the first nozzle configured to discharge a chemical onto the substrate, and the second nozzle configured to discharge deionized water onto the substrate, wherein the first nozzle includes a surface pattern configured to provide roughness on an inner surface of the first nozzle.

公开(公告)号：US20240131532A1

公开(公告)日：2024-04-25

申请号：US18465524

申请日：2023-09-11

Applicant: SEMES CO., LTD. ,  Samsung Electronics Co., Ltd.

Inventor： Jong Han KIM ,  Jin Uk SONG ,  Rae Taek OH ,  Ji Ho KIM ,  Ho Kyung KANG ,  Kwang Sung SON

IPC: B05B1/02

CPC classification number: B05B1/02

Abstract: According to at least one example embodiment, a substrate treating apparatus includes a substrate support structure including a spin head, the substrate support structure configured to support a substrate, and rotate the substrate, at least one treating liquid recovery container configured to recover at least one substrate treating liquid, and a discharging device including a first nozzle and a second nozzle, the first nozzle configured to discharge a chemical onto the substrate, and the second nozzle configured to discharge deionized water onto the substrate, wherein the first nozzle includes a surface pattern configured to provide roughness on an inner surface of the first nozzle.

公开(公告)号：US20160118241A1

公开(公告)日：2016-04-28

申请号：US14879389

申请日：2015-10-09

Applicant: Semes Co., Ltd.

Inventor： Seong Soo LEE ,  Keunje JO ,  Soon Kab KWON ,  Jong Han KIM ,  Bok Kyu LEE ,  Yoon-Jong JU

IPC: H01L21/02 ,  B08B3/10 ,  B08B3/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: B08B3/102 ,  B08B3/024 ,  H01L21/67051 ,  H01L21/6715

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.

Abstract translation: 公开了一种基板处理装置。 基板处理装置包括限定用于在其中处理基板的空间的壳体，支撑并旋转基板在壳体中的旋转头，喷射单元，其包括用于将第一处理溶液喷射在放置在旋转头上的基板上的第一喷嘴构件 ，以及控制喷雾单元的控制器。 控制器喷射第一处理溶液，同时将第一喷嘴构件在衬底的边缘和中心区域之间以及衬底上方移动。 所述控制器不同地调节所述第一处理液喷射到所述基板的边缘区域上的第一高度以及所述第一处理溶液喷射到所述基板的中心区域的第二高度。

公开(公告)号：US20240203756A1

公开(公告)日：2024-06-20

申请号：US18470474

申请日：2023-09-20

Applicant: SEMES CO., LTD.

Inventor： Joon Hwan JANG ,  Jong Han KIM ,  Dong Gyu LEE

IPC: H01L21/67

CPC classification number: H01L21/67017

Abstract: The present disclosure provides an integrated exhaust duct and a substrate processing apparatus.
The integrated exhaust duct according to the present disclosure includes: an integrated duct body having a plurality of exhaust regions and an exhaust hole communicating with the plurality of exhaust regions; and a hole partition wall disposed inside the exhaust hole to divide the exhaust hole so that the plurality of exhaust regions are blocked from communicating with each other by passing through the exhaust hole.

公开(公告)号：US20220181169A1

公开(公告)日：2022-06-09

申请号：US17520588

申请日：2021-11-05

Applicant: SEMES CO., LTD.

Inventor： Seung Tae YANG ,  Jong Han KIM ,  Do Gyeong HA

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate processing apparatus a processing liquid supply unit includes a nozzle supplying a processing liquid onto the substrate, a supply line connected to the nozzle to supply the processing liquid to the nozzle, and a cooler cooling the processing liquid. A volume of the processing liquid is reduced by the cooler so that the processing liquid may be sucked.