公开(公告)号：US20250140577A1

公开(公告)日：2025-05-01

申请号：US18926562

申请日：2024-10-25

Applicant: SEMES CO., LTD.

Inventor： Ju Yeon SONG ,  Sang Min LEE

IPC: H01L21/67

Abstract: Disclosed is a substrate treating apparatus including: a chamber providing a treatment space therein; a substrate support member located inside the chamber and for supporting a substrate; a supply port for supplying a treatment fluid into the treatment space of the chamber; a filler member located between the supply port and the substrate to fill a portion of a volume of the treatment space, in which the filler member has perforations, and the perforations are provided in a collision shape such that treatment fluids passing through the perforations collide each other.

公开(公告)号：US20250006517A1

公开(公告)日：2025-01-02

申请号：US18672290

申请日：2024-05-23

Applicant: Semes Co., Ltd

Inventor： Sang Min LEE ,  Jong Doo LEE ,  Ju Yeon SONG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

Abstract: Disclosed is a manufacturing method of a semiconductor device. The manufacturing method may include: a closing operation of seating a substrate on a support member provided in a chamber, and closing the chamber to seal a treating space provided by the chamber; a clamping operation of clamping the chamber by moving a clamping body in a direction facing the chamber after the closing operation; a close-contact operation of making the chamber be in contact with the clamping body after the clamping operation; and a substrate processing operation of drying the substrate by supplying supercritical fluid into the treating space.

公开(公告)号：US20240203726A1

公开(公告)日：2024-06-20

申请号：US18241893

申请日：2023-09-03

Applicant: SEMES CO., LTD.

Inventor： Myung Seok CHA ,  Ki Bong KIM ,  Yong Hyun CHOI ,  Ju Yeon SONG

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67748 ,  H01L21/6776

Abstract: Proposed are an organic solvent supplying apparatus, a substrate processing method, and a substrate processing apparatus. An organic solvent supplying apparatus according to an embodiment supplies an organic solvent to a liquid processing chamber of a substrate processing apparatus, the substrate processing apparatus including the liquid processing chamber for supplying the organic solvent to a substrate and a supercritical processing chamber for drying the substrate coated with the organic solvent using supercritical fluid. The organic solvent supplying apparatus includes a supply tank for storing the organic solvent, a supply line connected to the supply tank and the liquid processing chamber, and a cooling module provided on the supply line.