SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

    公开(公告)号:US20230081833A1

    公开(公告)日:2023-03-16

    申请号:US17892214

    申请日:2022-08-22

    Abstract: Provided is a substrate treating apparatus including: a fluid supply unit supplying a supercritical fluid to the treatment space, a plurality of components installed in the fluid supply line; and a detection member detecting whether or not metal particles are released from the component. The detection member includes: an upstream detection port connected to the fluid supply line upstream from a first component which is one of the plurality of components; a downstream detection port connected to the fluid supply line downstream from the first component; and a detector provided to be coupled to a selected detection port between the upstream detection port and the downstream detection port, and detecting metal particles from a fluid flowing through the detection port from the fluid supply line.

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