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公开(公告)号:US20230129923A1
公开(公告)日:2023-04-27
申请号:US17971734
申请日:2022-10-24
Applicant: SEMES CO., LTD.
Inventor: Jin Woo JUNG , Jin Mo JAE , Sang Min LEE , Young Hun LEE , Yong Hyun CHOI , Yong Joon IM , Seung Hoon OH
IPC: H01L21/687 , H01L21/67 , B08B3/04 , B08B13/00
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.
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公开(公告)号:US20240116086A1
公开(公告)日:2024-04-11
申请号:US18117524
申请日:2023-03-06
Applicant: SEMES CO., LTD.
Inventor: Yong Hyun CHOI , Woo Young KIM , Dong Gyu JIN
CPC classification number: B08B3/08 , B08B3/02 , B08B5/00 , B08B7/0071 , B08B7/04 , B08B2220/01 , F26B3/06
Abstract: A substrate processing facility includes a cleaning device for cleaning a substrate; and a drying device for drying the substrate cleaned by the cleaning device with a supercritical gas, wherein the cleaning device includes a sulfuric acid cleaning chamber.
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公开(公告)号:US20230201884A1
公开(公告)日:2023-06-29
申请号:US18068917
申请日:2022-12-20
Applicant: SEMES CO, LTD.
Inventor: Yong Hyun CHOI , Young Hun LEE , Seung Hoon OH , Mi So PARK , Tae Jong CHOI , Yong Sun KO , Jin Woo JUNG
CPC classification number: B08B3/022 , F26B5/005 , H01L21/02057
Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.
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公开(公告)号:US20240203726A1
公开(公告)日:2024-06-20
申请号:US18241893
申请日:2023-09-03
Applicant: SEMES CO., LTD.
Inventor: Myung Seok CHA , Ki Bong KIM , Yong Hyun CHOI , Ju Yeon SONG
IPC: H01L21/02 , H01L21/67 , H01L21/677
CPC classification number: H01L21/02101 , H01L21/02057 , H01L21/67034 , H01L21/67748 , H01L21/6776
Abstract: Proposed are an organic solvent supplying apparatus, a substrate processing method, and a substrate processing apparatus. An organic solvent supplying apparatus according to an embodiment supplies an organic solvent to a liquid processing chamber of a substrate processing apparatus, the substrate processing apparatus including the liquid processing chamber for supplying the organic solvent to a substrate and a supercritical processing chamber for drying the substrate coated with the organic solvent using supercritical fluid. The organic solvent supplying apparatus includes a supply tank for storing the organic solvent, a supply line connected to the supply tank and the liquid processing chamber, and a cooling module provided on the supply line.
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