APPARATUS AND METHOD OF TREATING SUBSTRATE
    1.
    发明公开

    公开(公告)号:US20230203672A1

    公开(公告)日:2023-06-29

    申请号:US18146489

    申请日:2022-12-27

    Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

    SUBSTRATE PROCESSING APPARATUS AND TREATMENT SOLUTION SUPPLY UNIT

    公开(公告)号:US20250096013A1

    公开(公告)日:2025-03-20

    申请号:US18779707

    申请日:2024-07-22

    Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a chamber having a processing space for processing a substrate; a support unit disposed in the processing space and for supporting the substrate; a liquid discharge unit for supplying a treatment solution to the substrate and processing the substrate when processing the substrate; and a liquid supply unit for supplying a treatment solution to the liquid discharge unit, in which the liquid supply unit includes: a tank for storing the treatment solution; a liquid supply line for supplying the treatment solution in the tank to the liquid discharge unit; a vent line connected to the tank to discharge water-containing gas in the tank; a heater for heating the treatment solution in the tank or the treatment solution circulating from the tank; and a condensate discharge line connected to the vent line and for discharging condensate generated from the water-containing gas.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20230366100A1

    公开(公告)日:2023-11-16

    申请号:US18298416

    申请日:2023-04-11

    CPC classification number: C23F1/08

    Abstract: A substrate processing apparatus includes a substrate processing unit for processing a substrate by discharging a chemical liquid to the substrate; a chemical storage unit connected to the substrate processing unit by a chemical liquid supply line and a chemical liquid recovery line; and a liquid replenishment unit including an evaporation measurement member for measuring the amount of evaporation of water contained in the chemical liquid, and a water supply member for supplying water to the chemical liquid.

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