公开(公告)号：US20230203672A1

公开(公告)日：2023-06-29

申请号：US18146489

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Jun Kil HWANG ,  Min Jung KIM ,  Hee Hwan KIM ,  Seong Soo LEE

IPC: C23F1/46 ,  B08B3/02 ,  B08B3/08 ,  B08B3/04

CPC classification number: C23F1/46 ,  B08B3/022 ,  B08B3/08 ,  B08B3/041 ,  B08B2203/007 ,  H01L21/02057

Abstract: Disclosed is a method of adjusting a concentration of a chemical liquid in a treatment liquid, the method including: treating a substrate by supplying a treatment liquid stored in a main tank from a nozzle in a heated state to the substrate, and recovering the treatment liquid used in the treatment of the substrate to the main tank directly or via still another tank, and then reusing the recovered treatment liquid, a concentration adjustment operation of adjusting a concentration of the treatment liquid in the main tank is performed in a standby time period in which the substrate is not treated with the treatment liquid, and the concentration adjustment operation is performed by discharging the treatment liquid in a heated state from the nozzle to evaporate a part of the diluting solution, and recovering the discharged treatment liquid to the main tank.

公开(公告)号：US20250096013A1

公开(公告)日：2025-03-20

申请号：US18779707

申请日：2024-07-22

Applicant: SEMES CO., LTD.

Inventor： Min Kyoung KIM ,  Jun Kil HWANG ,  Hee Hwan KIM

IPC: H01L21/67

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a chamber having a processing space for processing a substrate; a support unit disposed in the processing space and for supporting the substrate; a liquid discharge unit for supplying a treatment solution to the substrate and processing the substrate when processing the substrate; and a liquid supply unit for supplying a treatment solution to the liquid discharge unit, in which the liquid supply unit includes: a tank for storing the treatment solution; a liquid supply line for supplying the treatment solution in the tank to the liquid discharge unit; a vent line connected to the tank to discharge water-containing gas in the tank; a heater for heating the treatment solution in the tank or the treatment solution circulating from the tank; and a condensate discharge line connected to the vent line and for discharging condensate generated from the water-containing gas.

公开(公告)号：US20250046597A1

公开(公告)日：2025-02-06

申请号：US18735356

申请日：2024-06-06

Applicant: SEMES CO., LTD.

Inventor： Hee Hwan KIM ,  Bok Kyu LEE ,  Young Hun LEE

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  B08B7/00

Abstract: Disclosed is a method of treating a substrate, the method including: a first pre-wet operation of supplying a first pre-wet liquid to a rotating substrate; a second pre-wet operation of supplying a second pre-wet liquid having a temperature different from the first pre-wet liquid to the rotating substrate, the second pre-wet operation being performed after the first pre-wet operation; and a chemical treatment operation of supplying a chemical that is a liquid of a different type from the first pre-wet liquid and the second pre-wet liquid to the rotating substrate, the chemical treatment operation being performed after the second pre-wet operation.

公开(公告)号：US20240153792A1

公开(公告)日：2024-05-09

申请号：US18387713

申请日：2023-11-07

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Jung KIM ,  Jin Ah HAN ,  Hee Hwan KIM ,  Yong Hoon HONG ,  Kyoung Suk KIM ,  Jong Hyeok PARK ,  Jin Hyung PARK ,  Dae Hyuk CHUNG ,  Ji Hoon CHA

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/6708 ,  H01L21/30604

Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution. The apparatus includes a substrate rotating device configured to rotate a seated substrate in a spinning manner, a chemical solution supply device configured to supply a chemical solution to the substrate, a chemical solution discharge line configured to discharge the chemical solution having undergone a process to an outside, a chemical solution circulation line configured to circulate the chemical solution having undergone the process to the chemical solution supply device, and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of process by-products to the outside through the chemical solution discharge line and to circulate a chemical solution containing a second amount of process by-products through the chemical solution circulation line, wherein the first amount of process by-products is larger than the second amount of process by-products.