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公开(公告)号:US20240210057A1
公开(公告)日:2024-06-27
申请号:US18522675
申请日:2023-11-29
Applicant: SEMES CO., LTD.
Inventor: Yunhwa HONG , Haneul YOO , Kiwon HAN , Junho SEO
IPC: F24F9/00 , F24F3/14 , H01L21/67 , H01L21/677
CPC classification number: F24F9/00 , F24F3/14 , H01L21/67253 , H01L21/67706 , H01L21/67742 , F24F2009/005
Abstract: A humidity control device in a process space allows each process space to satisfy a unique humidity condition and includes an injection module arranged in a second process space maintained at second humidity lower than first humidity within a first process space in which processing for a wafer is performed and configured to inject a gas for forming an air curtain onto a first door through which the wafer enters and exits and which is connected to the second process space, a signal generation module configured to generate an injection signal for the injection module to inject the gas, and an injection control module configured to, when the injection signal is generated, control the injection module to form the air curtain lowering an amount of humidity flowing into the second process space through a space opened by the first door by injecting the gas.
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公开(公告)号:US20210054507A1
公开(公告)日:2021-02-25
申请号:US16997491
申请日:2020-08-19
Applicant: SEMES CO., LTD.
Inventor: Seunghan LEE , Jongsu CHOI , Jong Seok SEO , Junho SEO , Younghun JUNG , Kyungjin SEO , Jung-Hyun LEE , Moon Hyung BAE , Sang Jin BAE
IPC: C23C16/455 , H01L21/67 , C23C16/44
Abstract: An embodiment of the inventive concept provides an apparatus for treating a substrate. The apparatus for treating a substrate includes a chamber having a treating space inside the chamber and a gas inlet unit entering a gas into the treating space. The gas inlet unit includes an introduction pipe through which the gas is entered, and a discharging plate in which a discharging hole discharging the gas entered through the introduction pipe is formed. The discharging hole is arranged such that density for each area of the discharging plate is different.
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